We use 3D printed ceramic substrate technology to support a micro-interconnected structure with line width accuracy of ± 5 Μ M and aperture of 50 Μ M, which can carry the heterogeneous integration requirements of IGBT module and AI chip. In the onboard ECU carrier plate scheme, the chip package volume is reduced by 60%, and the signal delay is reduced to 0.1 P S/MM.
