Glass Substrate

Name: Glass Substrate
Brand: DEEPETCH

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Application Areas

Industry applications

Significant advantages:

Semiconductor packaging:

AI computing power chip: Glass substrate (such as the glass interlayer planned by Intel) can carry large size chips (> 120MM x 120MM), solve warping problems and improve heat dissipation efficiency.

Power devices: used in electric vehicle inverters and laser headlights, capable of withstanding high power density and thermal shock.

Display technology:

MICRO LED/MINI LED: Glass substrate supports high precision mass transfer, reduces the thickness of display modules, and improves brightness and contrast.

Transparent screen: used for commercial advertising and on-board display to achieve full transparent visual effect.

High frequency communication: In 5G/6G base station RF components, the high frequency signal integrity of glass substrate is better than that of traditional PCB.
Wearable devices: flexible glass substrate is suitable for folding screens and AR/VR devices, taking into account lightness and durability.

IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

01

Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

02

MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

03

We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

01

Electronic manufacturing services and printed circuit board assembly.

02

EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

03

PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.