IGBT and MOSFET: buried oxygen layer isolation for high voltage (>1200 V) and reduced on-state resistance.
Automotive electronics: used in engine control units (ECUs) and battery management systems (BMS), with tolerance to extreme temperatures of-40℃ to 150℃.
Radio frequency front end (RF-SOI): Used for 5G millimeter wave RF switches (such as SKYWORKS’S SKY5® series), insertion loss <0.5 DB
5G chip: SOI’s low parasitic capacitance and high cutoff frequency (FT>200 GHZ) improve signal transmission efficiency.
Millimeter wave radar: used for 77 GHZ vehicle-mounted radar chip to reduce signal loss.
Low-power processors: IBM’s POWER server chips use SOI technology to improve energy efficiency by 40%
Pressure sensor: the insulation of the buried oxygen layer is used to achieve high sensitivity and anti-interference ability.
Micro accelerometer: The mechanical stability of SOI supports high precision inertial measurement.
Gyro: SOI technology is used in MEMS gyroscopes to improve accuracy and stability
Aerospace: The buried oxygen layer reduces the charge accumulation caused by ionizing radiation and improves the ability to resist single particle flip (SEU).
Microprocessors: SOI technology is used in high-performance microprocessors to improve speed and reduce power consumption.
Quantum bits: Spin quantum bits of silicon in SOI structure, with decoherence time extended to more than 1 second
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
