IGBT module: multi-layer ALN/AL₂O₃ substrate reduces junction temperature and increases power density to 150 W/CM².
Laser diode array: low thermal resistance design (<1℃/W) to ensure beam stability.
5G RF module: LTCC supports 28 GHZ millimeter wave band and reduces the size by 50%.
Optical module: multi-layer structure to achieve optical-electrical hybrid packaging, transmission rate up to 100 GBPS.
Power lithium battery BMS: high temperature resistant (125℃), anti-vibration, to ensure the safety monitoring of battery pack.
Lidar (LIDAR): High density interconnect supports more than 128 channels of laser transmission/reception.
The ALN substrate is used for motor controller, and the heat dissipation efficiency is 5 times higher than that of AL₂O₃.
Satellite payload circuit: radiation resistant (total dose 10⁶ RAD), lightweight, suitable for deep space exploration.
Rocket engine controller: resistant to extreme temperature cycles (-196℃~300℃).
MRI gradient coil: high insulation (> 10¹⁴ Ω · CM) to avoid electromagnetic interference.
Implantable neural stimulator: airtight packaging (leakage rate <1 x 10⁻¹⁰ PA · M³/S) to prevent body fluid invasion
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
