IGBT module: multi-layer ALN/AL₂O₃ substrate reduces junction temperature and increases power density to 150 W/CM².
Laser diode array: low thermal resistance design (<1℃/W) to ensure beam stability.
5G RF module: LTCC supports 28 GHZ millimeter wave band and reduces the size by 50%.
Optical module: multi-layer structure to achieve optical-electrical hybrid packaging, transmission rate up to 100 GBPS.
Power lithium battery BMS: high temperature resistant (125℃), anti-vibration, to ensure the safety monitoring of battery pack.
Lidar (LIDAR): High density interconnect supports more than 128 channels of laser transmission/reception.
The ALN substrate is used for motor controller, and the heat dissipation efficiency is 5 times higher than that of AL₂O₃.
Satellite payload circuit: radiation resistant (total dose 10⁶ RAD), lightweight, suitable for deep space exploration.
Rocket engine controller: resistant to extreme temperature cycles (-196℃~300℃).
MRI gradient coil: high insulation (> 10¹⁴ Ω · CM) to avoid electromagnetic interference.
Implantable neural stimulator: airtight packaging (leakage rate <1 x 10⁻¹⁰ PA · M³/S) to prevent body fluid invasion
The SCH Series is a high-performance DAF/DDAF (Die Attach Film) designed to streamline and enhance the advanced packaging process....
The DEEPETCH DP-QPA2611 is a high-performance X-Band (8–12 GHz) Gallium Nitride (GaN) Power Amplifier...
The DEEPETCH DP-ROS-40121 is a premium, solvent-free epoxy die attach adhesive engineered for the most...
The Diamond Heat Spreader is a highly efficient thermal management material engineered for the most demanding...
Molybdenum copper composite: adjustable CTE, high conductivity, lower density than tungsten copper. No...
Tungsten copper composite: low CTE, high conductivity. Ideal for RF, power, optical packaging.
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
