Industry applications
SIGE HBT (heterojunction bipolar transistor): used in power amplifiers (PA) for 5G base stations and radar to achieve high gain (>20 DB) and low noise (noise factor <1 DB).
RF CMOS Integration: Combining silicon and germanium with complementary metal oxide semiconductor (CMOS) to improve the performance of radio frequency integrated circuits (RFIC).
GE/SIGE Photoelectric Detector: A high-speed response (> 10 GB/S) is achieved in optical fiber communication (1.3-1.55ΜM band) for the absorber layer of the photoelectric detector.
Optical communication: Silicon-germanium photodetectors are used in optical modules for data centers to improve data transmission rates (e.g., 400G/800G)
Silicon-based laser: an epitaxial layer for a laser that uses the SIGE/SI quantum well structure to break through the indirect band gap of silicon and emit light.
High performance logic chips: Introduce SIGE stress layer in FINFET or nanosheet transistors to improve carrier mobility and switching speed (such as INTEL 14NM process).
AI Chip: The high frequency and low power consumption characteristics of SIGE are suitable for the signal processing requirements of AI accelerator, which is suitable for real-time decision-making systems of autonomous driving and intelligent terminals.
Sensors: Short wave infrared (SWIR) sensors use SIGE epitaxial layers to enhance the environmental perception accuracy of autonomous vehicles
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
