High thermal conductivity (170-260 W/ (M·K)) supports the heat dissipation requirements of high power density devices (IGBT, MOSFET module, SIC module), and the operating temperature can reach more than 300℃.
The thermal expansion coefficient matches the LED chip (such as GAN) to avoid thermal stress cracking; the thermal conductivity is 5-10 times that of alumina, extending the life to more than 50,000 hours.
Low dielectric loss (TANΔ<0.0002), suitable for 5G millimeter wave band and high frequency radar system, microwave circuit substrate, RF filter
High temperature resistant (2000℃ non-oxidizing environment), radiation resistant (>100 KGY Γ ray), lightweight design (density 3.26 G/CM³). Engine nozzle, satellite power dissipation components
Engine control module: aluminum nitride ceramic substrate for high power modules in automotive electronics.
Laser diode: Aluminum nitride ceramic substrate is used for laser packaging to improve heat dissipation performance and stability.
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
