IGBT module: alumina ceramic substrate is used as the insulating substrate of power module to improve heat dissipation performance and reliability.
MOSFET Module: alumina ceramic substrate is used for the packaging of high frequency power devices.
It is superior to FR-4 substrate (thermal conductivity <0.3 W/ (M·K)), supports IGBT/MOSFET heat dissipation, and the operating temperature can reach 300℃.
LED substrate: Alumina ceramic substrate is used for the packaging of LED chips to improve heat dissipation performance and life, which is 50% lower than that of aluminum nitride (thermal conductivity 200+ W/ (M·K)), meeting the needs of general lighting; light efficiency is improved by 15%, and the life is>50,000 hours.
The dielectric loss (TANΔ<0.0002) is lower than that of plastic substrate and is suitable for 5G millimeter wave band.
The humidity resistance (85℃/85% RH) test is greater than 1000 hours through the AEC-Q200 certification.
Radiation resistance: anti Γ ray> 100 KGY, used in satellite power system.
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
