Photonics Integrated Circuit (PIC): Glass wafers are used as low-loss optical waveguide substrates for 400G/800G optical modules.
AR/VR optical devices: micro-nano structured glass wafers for making diffraction gratings and waveguides
Lithographic mask: Quartz glass is used for lithographic mask
Inertial sensor: glass wafer packaged silicon based MEMS structure, resistant to electromagnetic interference.
Microfluidic chips: used for biological detection, the chemical inertness of glass avoids sample contamination.
Pressure sensor: the low expansion coefficient of glass and silicon is used to reduce temperature drift
Gyroscope: Glass wafer used as the structural layer of MEMS gyroscope
OLED/LCD backplane: high flatness glass wafer supports TFT array to improve display uniformity.
MINI/MICRO LED: Temporary bonded glass carrier (CARRIER GLASS), solving the problem of massive transfer.
2.5D/3D packaging interposer: Glass through-hole (TGV) technology enables high density interconnection with 30% lower signal loss than silicon through-hole (TSV)
Insulating substrate: as a heat dissipation substrate in IGBT module, it replaces ceramic (such as AL₂O₃) and has both high thermal conductivity (1.4 W/ (M·K)) and insulation.
High voltage isolation: insulation support for power electronic equipment, withstand voltage> 10 KV.
The Diamond Heat Spreader is a highly efficient thermal management material engineered for the most demanding...
Molybdenum copper composite: adjustable CTE, high conductivity, lower density than tungsten copper. No...
Tungsten copper composite: low CTE, high conductivity. Ideal for RF, power, optical packaging.
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
