New energy vehicles: 800V SIC inverter module (such as Tesla MODEL 3 rear drive module).
5G communication: MASSIVE MIMO AAU power amplifier (Huawei32T32R equipment).
Aerospace: Starborne phased array radar T/R components (temperature resistant-196℃ ~ +200℃).
Industrial power supply: 10KV/1000A IGBT crimping package.
High thermal conductivity (>100 W/M·K) reduces junction temperature and improves device life; low CTE (6-8×10⁻⁶/K) matches SI/SIC chips and reduces thermal stress cracking. Suitable for electric vehicle inverters, industrial frequency converters, photovoltaic inverters.
High efficiency heat dissipation, improve LED light efficiency and life, copper high reflectivity can improve LED light output efficiency, suitable for car headlights, outdoor display screens, plant lighting.
Low dielectric loss (DBC ceramic insulation layer), suitable for high frequency applications, copper’s high conductivity reduces signal loss, suitable for 5G PA module, military radar, satellite communication.
High temperature resistance, vibration resistance, suitable for harsh vehicle environment, high current carrying capacity, suitable for high power electric drive system, suitable for electric vehicle motor controller, battery management system (BMS).
The SCH Series is a high-performance DAF/DDAF (Die Attach Film) designed to streamline and enhance the advanced packaging process....
The DEEPETCH DP-QPA2611 is a high-performance X-Band (8–12 GHz) Gallium Nitride (GaN) Power Amplifier...
The DEEPETCH DP-ROS-40121 is a premium, solvent-free epoxy die attach adhesive engineered for the most...
The Diamond Heat Spreader is a highly efficient thermal management material engineered for the most demanding...
Molybdenum copper composite: adjustable CTE, high conductivity, lower density than tungsten copper. No...
Tungsten copper composite: low CTE, high conductivity. Ideal for RF, power, optical packaging.
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
