High photoelectric conversion efficiency: the highest efficiency in the laboratory is 24.2% (2023 data), close to monocrystalline silicon (26.7%), and the theoretical limit is higher (~30%).
Broad spectral response: band gap 1.45 EV, covering visible to near infrared bands, suitable for weak light environment.
Low cost manufacturing: the film thickness is only a few microns, the material consumption is less, and the energy consumption is lower than that of crystalline silicon cells.
Flexible and lightweight: can be deposited on plastic or metal foil, suitable for wearable devices and building integrated photovoltaic (BIPV).
With low cost and high stability, it is suitable for the construction of desert power stations. In 2023, the global production of cadmium telluride components exceeded 11GW, with an annual growth rate of more than 10%.
It is used in infrared detectors, X-ray sensors and light-emitting devices, because its wide band gap (1.45 EV) characteristics are suitable for a variety of photoelectric conversion scenarios
High sensitivity: excellent response to medium and long wave infrared (3-14 ΜM), suitable for night vision, security and thermal imaging.
Fast response time: up to nanosecond level, better than traditional materials (such as HGCDTE).
No refrigeration: it can work at room temperature, reducing system complexity and cost.
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
