High temperature resistance: the working temperature can reach more than 500℃, far exceeding silicon (<150℃) and GAAS (<300℃), suitable for aerospace, oil exploration and other extreme environments.
High breakdown field: about 4 x 10⁶ V/CM, suitable for high voltage power electronic devices (such as thyristor, IGBT).
High thermal conductivity: ~0.5 W/CM·K, better than GAAS (0.46 W/CM·K), high heat dissipation efficiency.
Ultraviolet detector: sensitive to 200-400 NM ultraviolet light, fast response (sub-nanosecond), used for flame monitoring, ozone detection.
Laser diode: efficient light emission in the near-infrared band (850-900 NM) combined with GAAS to make vertical cavity surface emitting laser (VCSEL).
Solar cell window layer: as a anti-reflective layer to improve the efficiency of GAAS based laminated cells.
Lattice matching: with a mismatch rate of only 0.12% with GAAS, high quality heterojunctions (such as ALAS/GAAS) can be formed for high frequency transistors (HEMT, HBT).
Electronic limit layer: The high band gap ALAS layer can effectively limit the carrier and improve the device gain and frequency response.
Pressure sensor: high elastic modulus (~250 GPA) and low thermal expansion coefficient (5.2 x 10-⁶/℃), suitable for high precision pressure measurement.
Microelectromechanical systems (MEMS): used as high temperature resistant structural materials for automotive engine sensors
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
