The visible light transmittance is>85% (wavelength 400-800 NM). By optimizing the film thickness and refractive index, the reflectivity can be less than 1%, and the resistivity is as low as 15 × 10⁻⁴ Ω·CM. It is the best transparent oxide with the best conductivity at present. The high carrier concentration: electron concentration can reach 10²¹ CM⁻³, and the mobility is 2060 CM²/ (V·S).
Compared with other materials (such as aluminum doped zinc oxide), ITO has a better balance of conductivity and transparency, and is resistant to hydrogen plasma corrosion.
Display technology: Transparent electrodes for LCD and OLED, supporting high resolution and flexible screens.
Solar cells: As electrode materials to improve the efficiency of photoelectric conversion, especially in perovskite cells.
Low infrared emissivity: The average emissivity of ITO powder prepared by chemical co-precipitation method is only 0.60-0.75 in the 8-14 ΜM band, which is suitable for military infrared camouflage and photoelectric stealth.
Ultraviolet shielding: ITO films can block ultraviolet light, prolonging the life of devices and used in building glass and car coatings.
Gas sensor: the rich oxygen vacancy on the surface makes the detection limit of NO₂, H₂ and other gases as low as PPB.
Biosensor: The ITO electrode printed by screen printing combined with nano-modified materials can rapidly detect abnormal prothrombin with short response time and high sensitivity.
Excellent thermal stability (tolerance to 1400°C high temperature) and suitable for aerospace devices (such as jet engine sensors).
Strong radiation resistance, suitable for high energy physics and nuclear industry environment.
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
