Through ion implantation or diffusion technology, silicon (SI), zinc (ZN) and other elements are incorporated to adjust the electrical properties of gallium arsenide, and transistors, lasers, solar cells and other devices are manufactured using lithography, etching, deposition and other processes,
High electron mobility: The electron mobility is 8500 CM²/ (V·S), which is 5-6 times that of silicon (much higher than silicon’s 1400CM²/V·S). It is suitable for high frequency and high speed components (5G chips, radar). The breakdown electric field strength is 4×10⁵V/CM, which is suitable for high power RF devices.
Direct band gap structure: The direct band gap characteristic makes its light emission wavelength accurate (near infrared 900NM). It is used for remote control and optical communication module. The conduction band and valence band transition does not need phonon assistance, and the light emission efficiency is high, supporting laser, LED and other optoelectronic devices and detectors.
Negative resistance effect: the current decreases with the increase of voltage under high electric field, which is used in microwave oscillation devices.
High-speed digital circuits: Gallium arsenide resistivity (10⁷-10⁹ Ω·CM) significantly reduces microwave transmission for use in ultra-high speed computers and signal processing systems
Photoelectric conversion rate: Gallium arsenide single-junction solar cells can achieve a conversion efficiency of 28%, and multi-junction cells can achieve an efficiency of more than 40% (silicon cells are about 22%), which is widely used in satellites and spacecraft
High frequency and low noise: Field-effect transistors (MESFET) and high electron mobility transistors (HEMT) can operate at frequencies up to 60GHZ with a noise factor of less than 1DB, suitable for low noise amplifiers (LNA).
Environmental adaptability: heat resistance and radiation resistance: thermal conductivity is 55W/M·K, higher than silicon’s 150W/M·K, suitable for high temperature working environment, strong resistance to high energy particle irradiation, suitable for aerospace and military environment.
Semiconductor insulation: the substrate is electrically isolated by ion implantation to reduce device interference and improve integration.
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
