FAQ

What 3D Packaging Design Means for Modern Product Presentation

Q1: Can I use existing dielines when switching from traditional design workflows to 3D packaging? A: Yup, you can. Most tools let you bring in dielines. They turn them into spot-on 3D models. You don’t start from scratch when going digital. Q2: Is special software needed MOMENT needed to view interactive models created through DEEPETCH? A: Nope, no extra software. DEEPETCH’s interactive viewers work in normal web browsers with HTML5. Anyone can see them with a link, anywhere. Q3: How do I make sure my rendered visuals match the final printed product? A: Team up with folks like DEEPETCH who stick to strict package design rules. Their color checks ensure digital visuals match the real thing under standard industry lighting.

Drop Casting vs Spin Coating: Which Method Ensures Better Precision?

Q1: Can I Use Both Methods in One Project? A: Yes. Use drop casting for early tests to screen materials. Then, switch to spin coating for precise layers once you find good materials. Q2: Is Spin Coating Good for Thick Films? A: Not really. Spin coating is best for thin, even layers (under 10 µm). For thicker films, other methods like doctor blading might be better, depending on the material’s thickness. Q3: Do I Need Training for DEEPETCH Systems? A: No. DEEPETCH systems are simple to use, with easy interfaces for new users. They also have advanced options on touchscreens for experts who want more control.

Semiconductor Materials: Key Trends Shaping the Global Supply Chain

Q1: Which raw material is most critical yet most at risk? A: Indium is one of the rarest elements used in optoelectronics. Its short supply raises big concerns for long-term sustainability if no substitutes are found soon. Q2: Why can’t we fully replace compound semiconductors with silicon? A: Compound semiconductors work better in high-speed or high-heat settings where silicon struggles. Swapping them would hurt device efficiency. Q3: How does DEEPETCH help manufacturers with advanced node challenges? A: DEEPETCH provides flexible plasma etch platforms that work with both dry and wet methods. This is key below 5nm, where precision across multiple material layers is critical.

Understanding Chemical Vapor Deposition in the Context of CVD vs PVD

Q1: What makes Chemical Vapor Deposition better suited than physical methods for coating complex geometries? A: CVD uses surface reactions, not straight-line paths like PVD. This lets it cover deep grooves and sharp corners in advanced chip designs evenly. Q2: Can I deposit metals using Chemical Vapor Deposition? A: Yes, but you need special metal gases that break down cleanly. This is trickier than PVD, which easily blasts metals onto surfaces. Q3: How does DEEPETCH help improve thin film uniformity across large substrates? A: Their tools use smart gas flow and zoned heating to keep gases and heat even across big surfaces, even for thick layers.

Does ceramic material performance decay in high temperature sterilization scenario?

The ceramic components of alumina (AL₂O₃) surgical instruments can withstand up to 1400℃ through gradient sintering process, and the bending strength is still greater than or equal to 400MPA after 1000 times of autoclave sterilization.

Does the product meet the FDA and EU MDR medical certification requirements?

The whole system of materials passes FDA 21 CFR 820, EU MDR ANNEX XV and ISO 13485 system certification, and the production process adopts clean room grade CLASS 1000 environment.

How to respond to the small-batch customization needs of medical device manufacturers?

We adopt the modular flexible production line (minimum starting order of 50 pieces) and AI rapid proofing system. The delivery cycle of standard products is 7 days, and the customized scheme design cycle is 72 hours. After-sales service to provide 24 / 7 remote process debugging and lifelong material upgrade service

How does the ceramic carrier board fit into the precision integration requirements of miniaturized medical sensors?

Using 3D printed silicon nitride (SI₃N₄) substrate technology, it supports microchannel structures with line width accuracy ±2ΜM and aperture ≤30ΜM, capable of integrating biosensors and micro-pump systems. In blood glucose monitoring patches, the detection sensitivity is improved to 0.1MMOL/L, and the response time is shortened to 3 seconds.

Can ceramic tube shells meet the long-term biocompatibility requirements of implantable medical devices?

Zirconia (ZRO ₂) ceramic tube shell by nano-scale surface polishing process, surface roughness <0.05 Μ M. Combined with laser gas tight sealing technology, it can withstand 108 mechanical cycles and ensure the stable operation of implanted devices for more than 20 years.

How to ensure safety and reliability of third-generation semiconductor materials in medical devices?

Gallium nitride (GAN) power module adopts high temperature co-fired ceramic (HTCC) packaging technology, the voltage level is more than 650V, the leakage current is less than 0.1 Μ A, which meets the safety standard of IEC 60601-1 of medical equipment. In the case of portable defibrillators, charging efficiency is increased by 35% and volume is reduced by 50%.

How to reduce the BOM cost of the vehicle by using your scheme?

Collaborative innovation through Materials-Process-design: 1.Volume of motor controller reduced by 40% (reduce copper consumption by 28%) 2.Car-charger (OBC) assembly time down by 55% (modular package design) 3.System life cycle extended to 15 years / 300,000 km (reduced warranty cost) 4.The ECU package module maintenance rate decreased by 62%

How does the ceramic tube shell meet the high-frequency signal requirements of the ADAS sensor?

We provide special solutions for millimeter-wave radar: 1.Stable dielectric constant: 77 GHZ frequency band Ε R=9.2 ± 15 (temperature coefficient <30 PPM /℃) 2.Signal integrity: Insertion loss <0.08DB / MM @ 100 GHZ 3.Miniized package: Support 2424MM² package size (integrated 12 channel antenna array)

How to deal with the high cost of SIC power devices?

Through AI optimization of the substrate cutting process (30% increase in wafer utilization rate of 30%) and large-scale extension molding technology, SIC wafer cost is 25% lower than that of international brands, and the price of ceramic carrier plate is only 1 / 3 that of the traditional platinum electrode solution. At the same time, the design of high thermal conductivity substrate can reduce the input of heat dissipation module and improve the comprehensive energy efficiency by 20%.

Can ceramic carrier adapt meet the miniaturization and high integration requirements of automotive electronics?

We use 3D printed ceramic substrate technology to support a micro-interconnected structure with line width accuracy of ± 5 Μ M and aperture of 50 Μ M, which can carry the heterogeneous integration requirements of IGBT module and AI chip. In the onboard ECU carrier plate scheme, the chip package volume is reduced by 60%, and the signal delay is reduced to 0.1 P S/MM.

How can the ceramic tube shell guarantee the long-term reliability of the vehicle sensors?

Aluminum nitride (ALN) ceramic tube shell through multilayer compaction sintering process, porosity <0.01%, air tightness reaches the MIL-STD-883H standard, can withstand-40℃ ~150℃ extreme temperature cycle and 15G mechanical vibration. With the lidar (LIDAR) sensor, the detection distance can be increased to 300 meters, and the failure rate is less than 0.01%.

Can the third-generation semiconductor material (SIC / GAN) meet the high-voltage fast charging demand for electric vehicles?

Silicon carbide (SIC) MOSFET module adopts high temperature co-fired ceramic (HTCC) packaging technology, withstand voltage level of more than 1200V, with low conduction resistance (RDS (ON) <5 MΩ), the charging efficiency of 800V high voltage platform of electric vehicles can be increased to 98%, and the charging time can be shortened by 40%. The vehicle range is increased by 12%, and the volume of the battery thermal management system is reduced by 35%.

Can customize products for our special needs?

Provide the whole-process customization service: Optimization of material formulation (40% increase in thermal conductivity or precise control of dielectric constant) Precision machining capacity (± 0.005MM size tolerance, support for alien structure) Surface treatment technology (gold-plated / silver thickness up to 3 Μ M to meet the space welding requirements) Customer value: Avoid 80% compatibility issues and ensure seamless connection with existing space systems

What are the practical benefits of using your package scheme?

1.Power device volume is reduced by 40% 2.System heat dissipation cost is reduced by 28% 3.The module average interfault interval (MTBF) is increased to 50,000 hours.

How much cost can be saved for space projects by using your company’s solution?

Comparative analysis of on-orbit satellite data: 1.Communication load weight reduction of 48% (ceramic tube shell lightweight design) 2.In-orbit maintenance costs are reduced by 62% (material life>15 years) 3.22% (Modular Design Optimized Load Space)

How do you ensure the reliability of your ceramic carrier and tube shell in extreme aerospace environments?

Our products use the third generation of semi-semiconductor materials (such as silicon carbide, gallium nitride) and high-purity ceramic composite materials, through: 10 0,000 hour life test: simulate space radiation, extreme temperature (-200℃ to 1000℃) and vibration environment to ensure long-term stable operation. Military-grade packaging process: the sealing is IP69K, corrosion resistant and impact resistant. Customer value: reduce the failure rate of aerospace equipment, extend the maintenance cycle, and ensure the success rate of missions

How to ensure the stability of semiconductor materials in space radiation and extreme temperatures?

Our material is verified by the triple protection system: 1.Radiation resistance reinforcement: SIC substrate + gold palladium alloy shield, total radiation resistance up to 300 K RAD (SI) 2.Wide temperature domain operation: -269°C (liquid helium temperature zone) to + 350°C (NASA-ESA certification) Vacuum compatibility: gas output rate <110 ⁹ TORR · L / S / CM², meet the ASTM E595 aerospace standards

How to deal with the technical challenge of AI sensors for ultra-thin ceramic packaging?

We have developed nanoscale slurry printing technology, which can achieve ceramic tube shell wall thickness less than 0.2MM and bending strength greater than 400MPA, suitable for MEMS inertial navigation and lidar sensors.

Compared with competing products, what are the cost advantages of your products?

Through AI optimization of raw material ratio (loss rate reduced by 30%) and large-scale casting molding process, the cost of our SIC wafer is 25% lower than that of international brands. At the same time, high thermal conductivity substrate design can reduce the investment in heat dissipation module, and improve the comprehensive energy efficiency by 20%.

How to guarantee the delivery cycle and after-sales support of large-scale orders?

We have a fully automated HTCC production line (yield 99.5%) and global distributed storage, with a standard delivery cycle of 15 days and a 48-hour air access for emergency orders. After-sales service to provide 24 / 7 remote fault diagnosis and lifelong process upgrade service.

How does ceramic carrier board adapt to the trend of miniaturization and high density interconnection of AI chips?

We use 3D printed ceramic substrate technology to support the micro-interconnection structure with line width accuracy of ± 5 Μ M and aperture of 50 Μ M, which can carry the heterogeneous integration requirements of HBM 3 memory and AI processor. The chip package volume was reduced by 60%, and the signal delay was reduced to 0.1 P S/MM.

Does the air tightness of the ceramic tube shell meet the harsh environmental requirements of the AI optical module?

Our aluminum nitride (ALN) ceramic tube shell passes through the multi-layer compaction sintering process, the porosity is <0.01%, and the air tightness reaches the MIL-STD-883H standard. Combined with laser sealing technology, it can withstand the extreme temperature cycle of-40℃ ~150℃, ensuring zero distortion of high frequency signal transmission of 800G/1.6T optical module in the data center.

How to solve the problem of high power consumption and heat dissipation of the third-generation of semiconductor materials in the AI server power system?

Our silicon carbide (SIC) MOSFET module adopts high temperature co-fired ceramic (HTCC) packaging technology, temperature resistance of more than 200℃, thermal conductivity up to 180W / M · K, can improve the power conversion efficiency to 98% (25% higher than the traditional silicon-based devices). The volume of the cooling system is reduced by 50%, and the power consumption is reduced by 30%.

Ceramic materials in ultraviolet / infrared band?

Sapphire (AL₂O₃) optical window is polished by chemical mechanical polishing (CMP). The transmittance of ultraviolet band (200-400NM) is more than 85%, and the transmittance of infrared band (3-5ΜM) is more than 90%. The laser damage threshold is up to 10J/CM² (@1064NM).

How to deal with the small batch and multi-variety demand of optical device manufacturers?

We provide modular flexible production line (minimum minimum 50 pieces) and AI rapid proofing system. The delivery cycle of standard products is 7 days, and the design cycle of customized optical packaging scheme is 48 hours. After-sales support for 24 / 7 remote process debugging and lifelong material iteration service (such as anti-reflection plating upgrade).

Can ceramic carrier meet the precision integration requirements of miniaturized optical sensors?

We use 3D printed silicon nitride (SI ₃ N ₄) substrate technology to support a microoptical structure with line width accuracy of ± 1 Μ M and aperture of 20 Μ M, and can integrate TOF sensor and VCSEL array.

How to guarantee the air tightness and signal transmission accuracy of the optical module?

Our zirconium oxide (ZRO ₂) ceramic shell adopts nanoscale surface polishing technology, with surface roughness <0.01 Μ M, combined with 1 co-crystal sealing process, with air tightness of 10 ^ -9 PA · M³ / S (helium leak detection standard), which can be adapted to C band (insertion loss <0.1DB-1565 NM) of 400G / 800G optical module. After purchase, it provides third-party air tightness authentication and multi-channel optical coupling calibration services, compatible with LUMENTUM, II-VI and other mainstream laser chips.

How to solve the problem of heat dissipation of high-power semiconductor laser?

Aluminum nitride (ALN) ceramic thermal sinking substrate adopts gradient cofiring process, thermal conductivity up to 320W / M · K (more than 10 times of traditional alumina), which can control the junction temperature of 1000W laser diode within 85℃, and the life is extended to 50,000 hours.

How much comprehensive cost can be reduced by using your scheme?

Customer case data shows that: Lidar emission module yield increased by 22% (thanks to the thermal expansion matching of ceramic carrier plate) Infrared thermal imager assembly time 35% (modular package design) Full cycle maintenance cost of optical system reduced by 41% (material corrosion resistance)

How to ensure the packaging accuracy of ceramic tube shell?

We adopt a military-grade manufacturing system: 1.Nanoscale molding: the thickness tolerance is controlled at ± 0.8 Μ M (in accordance with MIL-PRF-55342) 2.Laser direct writing metallization: line width accuracy of 5 Μ M, adapted to meet the photonic integrated circuit (PIC) packaging requirements 3.Vacuum brazing process: helium leakage rate <110 ⁹ PA · M³ / S, ensuring the long-term vacuum of the optical cavity (based on the ISO 10110 standard test) Not applicable to the X-ray extreme radiation environment

How can the third generation of semiconductor materials improve the performance of high-power lasers?

Our ALN ceramic substrate and GAN-ON-SIC scheme have achieved three major breakthroughs: 1.Thermal management innovation: thermal conductivity is> 170W / MK, 300% higher than traditional alumina, ensuring the thermal stability at 1000W / MW ² power density 2.Wavelength consistency: surface roughness <0.05 Μ M, reducing 532 NM laser scattering loss by 67% 3.Long life verification: passed the IEC 60825 standard 2000 hours aging test, light decay <3%

What substantial benefits can be brought to the satellite project from selecting your products?

Based on the customer tracking data, our scheme can be implemented by: 1.The communication module is reduced by 35%, significantly reducing the launch cost 2.The system MTBF is increased to 150,000 hours, extending the in-orbit life 3.Overall BOM cost reduced by 18% (5-year cycle)

How does the ceramic packaging match the requirements of different satellite platforms?

We offer modular packaging solutions: Standardized component library: covering 7 standard dimensions from C band to KA band Quick customization channel: exclusive engineering team support to complete design iteration within 30 days Heat management patent: the three-dimensional microchannel heat dissipation structure reduces the thermal resistance by 60%

How to ensure that each batch of products meets the space-class reliability?

We implement a three-level space quality control system: 1.Gene screening: LIBS laser spectroscopy was used to detect the purity of raw material (> 99.9995%) 2.Dual process certification: IATF 16949 process control + ESA space components standard 3. Environmental simulation test: pass the MIL-STD-810H vibration test + 1000 hours xenon lamp aging test

Why are third-generation semiconductor materials more suitable for satellite communication systems?

Our gallium nitride (GAN) -based materials have three breakthrough advantages over traditional silicon-based components: 1.Extreme environmental stability: -55°C to + 200°C full performance fluctuation <2% (measured data) 2.Energy efficiency revolution: Power density increased by 5 times, and satellite energy efficiency increased by 40% + 3.Signal fidelity technology: the insertion loss under the millimeter-wave frequency band is <0.15DB to ensure zero error code for inter-star communication

If you encounter technical problems, can you get rapid technical support?

We provide drone industry-specific services: 724-hour response: issue a preliminary solution to emergency problems within 12 hours. Joint commissioning: engineers can be dispatched for key customers to participate in the installation testing. Value positioning: not only the supplier, but also your UAV reliability partner.

How to ensure the structural reliability of the ceramic tube and shell in the high-frequency vibration environment of the UAV?

We have a three-pronged approach: Military grade test: Pass MIL-STD-810G vibration test (20-2000 HZ, 3 hours each). Flexible welding process: the fatigue strength of silver copper solder is increased by 70% to prevent solder cracking. Prevent bad review: provide vibration test video + third-party test report double verification.

If your products are relatively expensive, are they suitable for small and medium-sized UAV manufacturers?

Our cost-effective advantages are reflected in: Batch discount: 15% step discount for 1,000 orders. Life cycle cost: material life up to 100,000 flight hours, maintenance cost reduced by 50%. Rapid iteration support: help design optimization matching scheme, shorten the customer development of new product cycle by 30%. Value positioning: the initial investment in exchange for long-term reliability, to avoid the crash risk caused by component failure.

Uav sensors and communication modules need high-precision packaging. How can ceramic carrier plates ensure signal integrity?

We adopt the following technical support: Ultra-low dielectric loss: dielectric constant <5, reduce signal interference, bit error rate reduced by 90%. Multi-layer precision wiring: support 0.1MM line width / line spacing, suitable for millimeter-wave radar and other high-frequency components. Anti-electromagnetic interference (EMI): embedded shielding layer design, passed the FCC PART 15 standard test. Eliminate anxiety: provide sample measurement and feedback measured data.

The UAV requires extremely high material weight and high temperature resistance. How can your third-generation semiconductor materials (such as SIC / GAN) meet these requirements?

Designed for a harsh drone environment: Lightweight: The density of ceramic carrier plate is 40% lower than that of traditional metal, which helps reduce the weight and improve the endurance of UAV. High temperature tolerance: can operate stably from-60°C to 350°C, suitable for engine compartment/motor high temperature area. High frequency response: the signal transmission delay is lower than 0.1NS, improving the real-time performance of the flight control system. Value proposition: Choose us = longer flight time + more reliable extreme environment performance.

Are our sensors used for medical devices consistent with industry certification?

Full compliance: Complete certification: ISO 13485 medical equipment certification, IATF 16949 automotive grade quality control. Biocompatibility: The ceramic materials pass the USP CLASS VI test, with zero heavy metals. Confidentiality agreement: NDA can be signed for medical customers and provide exclusive supply chain isolation.

How to deal with quality problems?

We promise to: 15 days without reason to replace: cover the package damage, performance inconsistency and other scenarios. Lifelong technical support: response to quality problems within 24 hours, and field support from engineers if necessary.

The product price is higher than the average market price, how to prove the return on investment?

Our premium comes from: Cost optimization: increase the thermal conductivity by 30% and reduce the cost of heat dissipation components by 15%. Failure rate: the average after-sales problems are reduced by 60%. Value positioning: 6-12 months can recover the initial investment through cost reduction and efficiency increase.

How to ensure that the ceramic carrier plate / tube shell is compatible with our sensor design?

We provide: Free adaptation analysis: submit design drawings and provide compatibility data within 48 hours. Modular packaging scheme: support standard size (such as TO-8 / TO-5) and customized structure.

What are the core advantages of your third-generation semiconductor materials (SIC / GAN) in sensor applications compared with traditional materials?

Our third-generation semiconductor materials have the following advantages: High temperature stability: stable operation in-50°C to 300°C extremes, suitable for industrial / automotive sensors. High frequency and high efficiency: reduce the sensor signal loss by more than 20%, improve the response speed and accuracy. Long life design: through 1,000 hours of aging test, the life is 3 times longer than the traditional materials. Value positioning: Choose us = higher sensor performance + lower long-term maintenance costs.

How to coordinate the third-generation semiconductor materials, ceramic carrier plate / shell and equipment to improve the production line efficiency?

We provide an integrated solution of "materials + devices + equipment": Semiconductor equipment: high-precision wafer bonding machine (± 5 Μ M alignment accuracy), ceramic sintering furnace (1600℃ uniform temperature control) Materials and devices: silicon defect density (<100CM ²) and customized loading plates Value point: Customers can improve the efficiency of the whole process from material processing to device packaging by 40%, and the yield is stable at more than 98.5%.

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