跳到内容
Products & Service
Wafer raw materials
Substrate material
Ceramic Package
IC packaging substrates
Equipment
Sensor chip series
Silicon wafer
Monocrystalline silicon
Polysilicon
Epitaxial Silicon
Compound semiconductor wafers
Gallium Arsenide (GaAs)
Indium Phosphide (InP)
Gallium Nitride (GaN)
Silicon Carbide (SiC)
Oxide semiconductor wafer
Zinc Oxide (ZnO)
Indium Tin Oxide (ITO)
Compound Semiconductors
Cadmium Telluride (CdTe)
Aluminum Arsenide (AiAs)
Indium Arsenide (InAs)
Other Materials
Germanium
Silicon-germanium (SiGe)
Graphene
Fourth generation semiconductor materials
Diamond
Glass
Glass Wafer
Silicon on Insulator
(Soi)
Substrate Material
Ceramic Substrate
Alumina
Aluminum Nitride (AIN)
Zirconia
Silicon Nitride
Multilayer ceramic
Inorganic substrate
Glass substrate
Metal substrate
Copper substrate
Aluminum substrate
Organic substrate
FR-4 (glass fiber reinforced epoxy resin)
ABF substrate (Epoxy Deposited Film)
BT resin (bismaleimide triazine resin)
Ceramic Dual In-line Package (CDIP)
Butterfly Package
Ceramic Quad Flat Package (CQFP)
Ceramic Pin Grid Array Package (CPGA)
Ceramic Small Outline Package (CSOP)
Ceramic Leadless Chip Carrier Package (CLCC)
Ceramic Ball Array (CBGA)
Ceramic SOP
Ceramic DIP
Ceramic QFP
FCBGA Substrate
FCCSP Substrate
SAP Process
mSAP Process
Tenting process
Coreless Process
Maskless Lithography/LDI-laser direct imager
Mask Aligner
Wet etching equipment
ICP RIE System (III-V and Metal Etching)
Deep RIE System (SiOx, SiNx and Deep Si Etching)
PECVD (Plasma Enhanced Vapour Deposition System andGas System for Etching&PECVD Systems
Optical Microscopes
DC–RF Sputter System
E-beam Evaporation System
ALD System (Atomic Layer Deposition)
Automatic Dicing Saw Machine
Oxygen Plasma System
Probe station
AOI test equipment
Ellipsometers
Reflectometer
Packaging equipment
X-RAY testing equipment
X-RAY point equipment
Electroplating equipment
Glovebox System
High temperature furnace
Vacuum furnace
Tunnel furnace
Rapid Thermal Annealer
Wafer polishing equipment
Wafer thinning device
Raman Microscope and Spectrometer RAMAN
Wire&Die Bonder Machine
Scanning Electron Microscope&EDS-Energy Dispersive Spectrometer
Sensor chip series
Customizable sensor series
IDM
Industry
Solutions
Solutions
industry
Healthcare
Aerospace
Automotive
Al Industry
Communications Industry
Optical Applications
Sensor Industry
Drone Industry
About Us
Contact Us
News Center
New
Blog
Chips In-stock
X
Home
Products Center
ABF substrate (epoxy resin deposited film)
Alumina Ceramic Substrate
Aluminium Arsenide (AiAs)
Aluminium Nitride (AIN)
Aluminum Substrate
BT resin (bismaleimide triazine resin)
Butterfly package
Cadmium Telluride (CdTe)
Ceramic ball array housing (CBGA)
Ceramic double row direct insertion package (CDIP)
Ceramic four-sided lead flat package (CQFP)
Ceramic leadless chip carrier housing (CLCC)
Ceramic needle grid matrix encapsulated (CPGA)
Ceramic small form factor packaged (CSOP)
Copper Substrate
Diamond
Epitaxial silicon
FR-4 (glass fiber reinforced epoxy resin)
Gallium Arsenide (GaAs)
Gallium Nitride (GaN)
Germanium
Glass Substrate
Glass wafer
Graphene
Indium Arsenide (InAs)
Indium phosphide (InP)
Indium Tin Oxide (ITO)
Monocrystalline silicon
Multilayer Ceramic Carrier
Polycrystalline silicon
Pottery and porcelain DIP
Pottery and porcelain QFP
Pottery and porcelain SOP
Silicon And Germanium (SiGe)
Silicon Carbide (SiC)
Silicon Nitride
Silicon On Insulators (Soi)
Zinc Oxide (ZnO)
Zirconia
IDM
About Us
Contact Us
About DEEPETCH
Company Overview
News Center
Blog
New
Chips In-stock
Industry
Aerospace
AI Industry
Automotive
Communications Industry
Drone Industry
Healthcare
Optical Applications
Sensor Industry
Solutions
X
FAQ
Solutions
Solutions
Home
Solutions
FAQ
Can a Sensor Chip Truly Achieve Both High Linearity and Extreme Sensitivity
How Does Computational Power Drive the Future of Technology
Hot vs Cold Climates for Data Centers Which Wins
Can Optical Communication Overcome Atmospheric Barriers in Ground Links
No posts found
learn more
Solutions
Semiconductor ceramic shells and ceramic substrates in the medical and health industry
2025-02-24
Cherpter 1 Constantly achieve micro and integration High integration and multi-layer circuit design Through...
Semiconductor ceramic shell and ceramic substrate application solutions in the UAV industry
2025-02-24
Charpter 1 Lightweight quantification and structural strength Lightweight advantage Material density...
Application solutions of semiconductor ceramic tube shells and ceramic substrates in the field of communications
2025-02-24
Chapter 1 Thermal management I. Ultra-high thermal conductivity and high-frequency heat dissipation capabilities...
Application of semiconductor ceramic tube shells and ceramic substrates in the automotive industry
2025-02-24
Chapter 1 Reliability and Durability I. Technical Advantages of Ceramic Shell 1. High Airtightness and...
Application of semiconductor ceramic tubes and ceramic substrates in the aerospace field
2025-02-24
Chapter 1 Adaptability to Extreme Environments 1. Extreme Temperature Tolerance The thermal conductivity...
Advantages of semiconductor ceramic tubes and ceramic substrates in the optical field
2025-02-24
Chapter 1 Thermal management performance 1. High thermal conductivity and low thermal resistance The...
Semiconductor ceramic shells and ceramic substrates help innovative applications in the sensor industry
2025-02-24
Chapter 1 Thermal management performance I. Technical indicators of ceramic shells 1. High thermal conductivity...
Application solutions of ceramic shells and ceramic substrates in the field of AI artificial intelligence
2025-02-24
Charpter 1 Air tightness and heat dissipation performance Advantages of air tightness technical index...
No posts found
