High computing power, low power consumption, strong stability, —— redefines the future boundary of the UAV
Deepetch Semicon, as the “digital center” of drones, are pushing the industry from “flight tools” to “intelligent terminals” with disruptive technological innovation. Through 5 NM advanced process technology and heterogeneous integrated architecture, the chip can achieve trillion operations per second (TOPS) between square inches, and the power consumption is reduced by 60%, completely solving the industry pain points of “short endurance, slow response and narrow scene”.
DJI new generation OCUSYNC 4.0 chipset integrates 5G millimeter wave and AI acceleration engine, supports 30 km over-visual-horizon communication and real-time 4K video stream analysis, makes agricultural plant protection UAV can accurately identify 98% of diseases and insect pests; and Qualcomm FLIGHT RB5 5G platform with multi-core heterogeneous computing capability, makes logistics UAV realizes 0.1 m level obstacle avoidance accuracy and millisecond path planning in complex urban environment.
Technological innovation drives the breakthrough of the three major scenarios
Industrial-grade UAV:
The inspection UAV has a computing power of 275TOPS and can process lidar point cloud data in real time, improving the accuracy of transmission line defect identification to 99.5%;
The hydrogen fuel cell power system with silicon carbide (SIC) power chip enables the heavy UAV to exceed 12 hours and have a payload capacity of 50 KG.
Consumer-grade drones:
It supports 8K HDR video coding and dual-channel AI neural network, so that aerial drones can intelligently track targets and automatically clip into pieces. It integrates multi-band positioning technology to improve the anti-interference ability of uav by 10 times, and the positioning accuracy of complex urban areas reaches centimeter level.
Military special UAV:
The swarm drone based on the phased array radar chipset can realize 200 autonomous formation of clusters and dynamic target encirclement;
The gallium nitride (GAN) RF chip enables electronic warfare drones, extending the interference distance to 300 km and increasing the spectrum suppression efficiency by 80%.
Eco-level change: from single-machine to smart network
Smart city: the uav group equipped with environment sensing chip can monitor PM2.5, noise and other data in real time to generate three-dimensional pollution heat map of cities;
Emergency rescue: the search and rescue UAV based on UWB positioning chip penetrates 5 layers of concrete in the ruins to accurately locate life signals, and the response speed is 20 times faster than the manual;
Digital agriculture: farmland scanning drones supported by multispectral imaging chips to reduce crop health analysis costs per hectare to $1 and improve fertilizer utilization by 35%.
With the breakthrough of photonic computing chips and neuromimicry chips, the next generation of drones will have brain-like decision-making capabilities —— can independently navigate 1,000 kilometers in no satellite signals, or achieve 100GB of laser communication per second through optical chips. From the “flying spray” of spraying pesticides to the “agent” of building the low-altitude digital twin world, semiconductor chips, as the “intelligent brain” of drones, are promoting the leapfrog development of the industry with disruptive technologies. Through the nanoscale process and customized design, the chip brings millisecond level precision flight control, ultra-long endurance energy efficiency and complex environment adaptability to the uav, completely breaking through the traditional performance bottleneck. With the help of AI edge computing, 5G high-speed communication and multi-sensor fusion technology, the UAV can realize autonomous obstacle avoidance, real-time three-dimensional modeling and over-line-of-sight cluster collaboration, and fully enable high-end scenarios such as industrial inspection, precision agriculture and emergency rescue. From micro-consumer machines to industrial heavy machines, the continuous innovation of semiconductor chips is reshaping the application ecology of UAV and opening up the infinite possibilities of low-altitude economic intelligence.
