Ceramic Package
显示所有 10 结果
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Butterfly package
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Ceramic ball array housing (CBGA)
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Ceramic double row direct insertion package (CDIP)
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Ceramic four-sided lead flat package (CQFP)
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Ceramic leadless chip carrier housing (CLCC)
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Ceramic needle grid matrix encapsulated (CPGA)
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Ceramic small form factor packaged (CSOP)
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Pottery and porcelain DIP
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Pottery and porcelain QFP
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Pottery and porcelain SOP
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