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ABF substrate (epoxy resin deposited film)
Alumina Ceramic Substrate
Aluminium Arsenide (AiAs)
Aluminium Nitride (AIN)
Aluminum Substrate
BT resin (bismaleimide triazine resin)
Butterfly package
Cadmium Telluride (CdTe)
Ceramic ball array housing (CBGA)
Ceramic double row direct insertion package (CDIP)
Ceramic four-sided lead flat package (CQFP)
Ceramic leadless chip carrier housing (CLCC)
Ceramic needle grid matrix encapsulated (CPGA)
Ceramic small form factor packaged (CSOP)
Copper Substrate
Diamond
Epitaxial silicon
FR-4 (glass fiber reinforced epoxy resin)
Gallium Arsenide (GaAs)
Gallium Nitride (GaN)
Germanium
Glass Substrate
Glass wafer
Graphene
Indium Arsenide (InAs)
Indium phosphide (InP)
Indium Tin Oxide (ITO)
Monocrystalline silicon
Multilayer Ceramic Carrier
Polycrystalline silicon
Pottery and porcelain DIP
Pottery and porcelain QFP
Pottery and porcelain SOP
Silicon And Germanium (SiGe)
Silicon Carbide (SiC)
Silicon Nitride
Silicon On Insulators (Soi)
Zinc Oxide (ZnO)
Zirconia
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IC packaging substrates
ABF Substrates, BT Substrates, IC Substrate, Chip Substrate
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Coreless Process
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FCBGA Substrate
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FCCSP Substrate
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mSAP Process
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SAP Process
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Tenting process
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