Ceramic needle grid matrix encapsulated tube shell (CPGA)

• The core strengths of CPGA

CPGA (CERAMIC PIN GRID ARRAY) is a pin array package using ceramic substrates (AL₂O₃ or ALN) with significant advantages in high performance computing and high reliability:

1. Excellent heat dissipation performance

High thermal conductivity ceramic substrate: The thermal conductivity coefficient of ALN substrate is up to 150200 W/M·K. Combined with optimized pin layout, the thermal resistance (ΘJA) is as low as 1530°C/W, and can be integrated with metal heat sink (copper or copper tungsten alloy), which is suitable for high power chips (CPU, FPGA).

Bottom exposed design: can be directly contacted with the radiator, the thermal resistance is as low as 210°C/W, significantly better than plastic packaging (PGA).

2. High density interconnection capability

Pin array layout: supports hundreds to thousands of I/O pins (1001000+ pins), pin spacing is usually 2.54MM or 1.27MM, suitable for complex IC packaging.

Low parasitic inductance: Short pin design (<5MM) reduces lead inductance and capacitance effects and signal transmission loss, supports high-speed digital circuits (GHZ clock frequency), insertion loss can be controlled below 0.5 DB @10 GHZ

Electromagnetic shielding: The metallized layer provides EMI protection and reduces signal interference, suitable for RF device packaging

3. High reliability and environmental adaptability

High temperature resistance and airtightness: CPGA uses ceramic substrate (alumina or aluminum nitride) to withstand extreme temperatures (55°C to +175°C), glass or metal sealing, leakage rate <1×10⁻⁸ ATM·CC³/SEC, moisture resistant, corrosion resistant, and MILSTD883 certified.

Wide temperature operating range: 55°C to +200°C, resistant to extreme temperature cycles and mechanical shocks (space, military scenarios).

4. Mechanical stability

Rigid ceramic structure: bending strength> 300MPA, high tensile strength of pins (> 5N/pin), suitable for high vibration environment (automobile, aviation electronics)

• Key technical indicators in industry applications

| qualification         | Typical values/characteristics                     | Application impact

| Pin number/distance | 1001000+ pins, distance 1.27/2.54MM | High complexity IC (CPU, FPGA, ASIC) packaging

| Thermal resistance (RTH) | 210°C/W (depending on heat dissipation design)          | Supports the stable operation of 50200W high-power chips

| frequency response         | DC~5GHZ+                        | High-speed data processing, RF front-end module

| Air tightness grade | Helium leak rate <1×10⁻⁸ ATM·CC³/SEC | Long-term reliability guarantee for aerospace and deep-sea equipment

| Lead material         | Kovar alloy (KOVAR) or copper alloy | Low thermal expansion match (CTE ≈ 67 PPM/°C)

| Thermal cycle capacity | 65°C to +150°C                     No failure was found in 500 cycles

Compare other packaging types:

Plastic PGA (PPGA): low cost but poor temperature resistance (<125°C), high thermal resistance (> 15°C/W).

BGA/LGA: higher density but difficult to maintain, insufficient airtightness.

• Typical application scenarios

1. High performance computing and data centers

Server CPU/GPU: Intel early Xeon processor, high power consumption packaging of aerospace computing module.

FPGA accelerator card: high temperature resistant design of XILINX/ALTERA high computing power chip.

2. Aerospace and defense

Spaceborne computer: satellite radiation resistant processor (POWERPC architecture).

Radar signal processing: beamforming IC packaging for phased array radar.

Industry and energy

Power electronics control: high voltage IGBT drive, smart grid high temperature resistant packaging.

Oil exploration equipment: downhole high temperature electronic module (>175°C).

4. Automotive electronics (high reliability segment)

Autonomous driving master control chip: heat dissipation optimization design of automotive-grade AI processor (NVIDIA DRIVE).

Military communication on the vehicle: RF module resistant to electromagnetic interference (EMI)

• Future development trend

1. High frequency and heterogeneous integration

Low temperature co-fired ceramic (LTCC): integrated passive components, supports 10GHZ+ high frequency applications (6G communication).

2.5D/3D packaging: multi-chip stacking (CPU+HBM memory) through silicon interposer.

2. Upgrade of heat dissipation technology

Microchannel liquid cooling: embedded microfluidic channels solve the heat flux density of> 300W/CM².

Diamond substrate: local deposition of diamond, thermal conductivity>2000 W/M·K (IBM experimental scheme).

3. Cost optimization and lightweight

Aluminum silicon carbide (ALSIC) substrate: replace traditional ceramics to reduce weight (density <3G/CM³) and cost.

Standardized needle design: promote large-scale production and cost reduction (space commercialization needs).

4. Expansion of emerging areas

Quantum computing: cryogenic packaging of superconducting qubit control circuits (below 4K).

Space economy: Inclusive demand for high reliability CPGA from low cost satellites (STARLINK)

CPGA packaging has long dominated the aerospace, military, and high-performance computing sectors due to its ultra-high reliability, heat dissipation capabilities, and multi-pin advantages. In the future, with breakthroughs in heterogeneous integration, advanced cooling technologies, and low-cost materials, its applications will extend to cutting-edge fields such as 6G communications and quantum computing. It will also gradually penetrate emerging markets like automotive electronics and commercial space through standardization and large-scale production.