1. Power electronics and new energy
Electric vehicles: Silicon carbide MOSFET is used in inverters to improve the range by 10%~15%. Tesla, BYD and other car companies have adopted it on a large scale.
Photovoltaic and energy storage: The efficiency of photovoltaic inverters is increased to more than 98%, reducing energy conversion loss.
2. Communications and data centers
5G base station and RF devices: Semi-insulating silicon carbide substrate for gallium nitride (GAN) HEMT devices, supporting millimeter wave communications.
AI data center power supply: silicon MOSFET replaces silicon devices, improves power factor correction (PFC) efficiency, and reduces energy consumption by 12%~15%.
3. High temperature and extreme environment
Aerospace: radar, satellite power, nuclear reactor monitoring sensors, high temperature resistant components (rocket nozzles) and radiation resistant electronics.
Industrial manufacturing: hot pressed silicon carbide ceramics are used in wear-resistant bearings, welding machines, frequency converters, high temperature kilns (volume reduced by 50%), life increased by 5 to 20 times.
4. Emerging areas
AR/VR optical waveguide: High refractive index silicon carbide lens replaces glass to solve the problems of small field of view and heavy lens, and promote the development of lightweight AR equipment.
Quantum technology: as a single photon source material, it supports quantum communication and computing.
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
