Our ALN ceramic substrate and GAN-ON-SIC scheme have achieved three major breakthroughs:
1.Thermal management innovation: thermal conductivity is> 170W / MK, 300% higher than traditional alumina, ensuring the thermal stability at 1000W / MW ² power density
2.Wavelength consistency: surface roughness <0.05 Μ M, reducing 532 NM laser scattering loss by 67%
3.Long life verification: passed the IEC 60825 standard 2000 hours aging test, light decay <3%
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
