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ABF substrate (epoxy resin deposited film)
Alumina Ceramic Substrate
Aluminium Arsenide (AiAs)
Aluminium Nitride (AIN)
Aluminum Substrate
BT resin (bismaleimide triazine resin)
Butterfly package
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Ceramic ball array housing (CBGA)
Ceramic double row direct insertion package (CDIP)
Ceramic four-sided lead flat package (CQFP)
Ceramic leadless chip carrier housing (CLCC)
Ceramic needle grid matrix encapsulated (CPGA)
Ceramic small form factor packaged (CSOP)
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FR-4 (glass fiber reinforced epoxy resin)
Gallium Arsenide (GaAs)
Gallium Nitride (GaN)
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Indium phosphide (InP)
Indium Tin Oxide (ITO)
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Pottery and porcelain QFP
Pottery and porcelain SOP
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Zirconia
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/ Ceramic Leadless Chip Carrier Package (CLCC)
Ceramic Leadless Chip Carrier Package (CLCC)
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Ceramic leadless chip carrier housing (CLCC)
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