Customizable sensor series

  • Vacuum sensor
    Our full range of vacuum sensorproducts, including siliconpiezoresistive vacuum gauges andceramic thin-film vacuum sensors.cover ultra-high vacuum, highvacuum and vacuum environments ;
  • Tensile force sensor
    It features temperature stability.high linearity, small size, lightweight, fast response speed andhigh sensitivity
  • Force sensor
    Tensile force sensor,
    pressure sensor, torquesensor, load cellMeasure one-dimensional.two-dimensional, three-dimensional forces and six-dimensional forces;
  • Gas mass flowmeter
    Accurately measure andcontrol the flow rates ofgases such as oxygen,nitrogen and argon;High precision and highstability
  • Vibration sensor
    4-20mA RMS output, IP67Measure the absolutevibration velocity of theequipment; Industrial sitemonitoring, with strong anti-inferference performance,
  • Torque sensor
    No mechanical bearings, no wear,Accuracy: 0.5-0.1High-precision magnetoelectric rotationAngle/rotational speed measurementunit
    Compact flange connection with smallaxial dimension,
  • Pressure sensorMeasurement techniques: silicon

    piezoresistive, oil-filled silicon

    piezoresistive, ceramic capacitors and

    thin film sputtering;

    Pressure range: 0-2500bar

    Accuracy: 0.5% FS

    Operating temperature: -50-300ยฐC

    Provide pressure measurement solutions

    for various working environments

  • Temperature sensor
    NTC (negative temperature coefficientthermistor), PT platinum resistance,
    thermocouple,Temperature measurement range: -80 to2350ยฐC
    Provide a variety of temperaturemeasurement solutions for different workingenvironments;
  • Liquid mass flowmeter

Vortex flowmeterCoriolis mass flowmeterAccurately measurecorrosive liquids withoutdrift;

 

Ceramic thin-filmvacuum sensor

 

Optical gas massflowmeter

Liquid mass flowmeter

Force sensor

MEMS microgyroscope

Vibration sensor

Torque sensor

Temperature sensor

Application Areas

IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

01

Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

02

MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

03

We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

01

Electronic manufacturing services and printed circuit board assembly.

02

EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

03

PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.

News Center