Product Introduction
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation uses an improved semi-additive (amSAP) process or subtraction (Tenting) process. The FCCSP (Flip Chip Chip Scale Package) package board in the form of inverted chip packaging for the product.
The features of this type of product include small size, light weight, and relatively fewer layers. They are used in wearable, storage, and RF (radio frequency) applications
Package Structure
Features
|
Smaller micro via by new-generation laser drilling machine AMSAP |
Fine Line/Space by amSAP process |
|
Ultra thin board by Coreless or ETS Process |
Thin Thickness |
Small size |
High Density |
Build-up Structure
Process Capability
| Process Capability | Applications | |
| · Layer Count: | 2~8 SiP 4~16层 | · AP |
| Board Thickness | · 0.15~2.0mm | · BB |
| amSAP Line/Space | · 15/15μm | · RF |
| Tenting Line/Space | · 40/40μm | · PMIC |
| · Via/Land | Φ55/85μm | · Memory |
| · SRO | · Φ60μm | MEMS & Sensor |
| · SRO/Land Reg | · ±12.5μm | · |
| · Surface Finish | ENEPIG、OSP、ENEPIG+OSP | · |
| Micro bump Pitch | · 110μm | |
| · Coreless | · (2025H1) | |
| · Layer Count | · 3~11 | |
| Board Thickness | · 0.10~1.0mm | |
| · ETS | · (2025H1) | |
| · Layer Count | · 2~4 | |
| Board Thickness | · 0.10~0.25mm | |
| · Line/Space | · 10/10μm | |
FCCSP（Flip-Chip Chip Scale Package，）The package substrate realizes fine lines (line width ≤ 10 μm) through the modified semi-additive process (MSAP) and the embedded line process (ETS), and supports coreless substrates to improve heat dissipation efficiency. It is suitable for the following fields
1. Mobile communications and consumer electronics: smartphone application processors (AP), baseband processors (BB), WiFi/BT chips, power management chips (PMIC), RF modules, etc.
2. Automotive electronics: in-vehicle infotainment systems, advanced driver assistance systems (ADAS), autonomous driving controllers, and automotive-grade MCUs.
3. Artificial intelligence and 5G communications: AI accelerators (such as edge computing chips), 5G base station RF front-ends, and optical modules.
4. Storage chips and high-performance computing: USB flash drives, mobile hard disks, server memory controllers, and high-bandwidth memory (HBM) interfaces.
5. Internet of Things and industrial equipment: smart home modules, industrial automation controllers, medical imaging equipment.
6. RF and microwave modules: 5G millimeter wave antenna (AiP), radar system, satellite communication.
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
Equipment features: 1. Non-destructive precision testing Micrometer-level probe contact technology (minimum...
Equipment features: 1. Using maskless direct writing lithography technology, high-precision electron...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
