Pottery and porcelain DIP

Core advantages of CDIP

1. High reliability and long life

Extreme temperature resistance: The ceramic substrate (alumina) can withstand a temperature range of-55°C to +175°C, suitable for high temperature welding processes (wave soldering) and harsh environments.

Excellent air tightness: using glass or metal sealing technology, the leakage rate is less than 5 x 10⁻⁸ ATM·CC³/SEC, in line with MIL-STD-883 standard, effectively moisture-proof and oxidation-proof, and prolong the life of devices.

Anti-mechanical impact: The ceramic structure has high strength and better seismic performance than plastic DIP (PDIP), which is suitable for high vibration scenarios (aerospace equipment).

2. Stable electrical performance

Low dielectric loss: The dielectric constant of alumina ceramic (~9.8) is suitable for medium and high frequency circuit design to reduce signal attenuation.

Electromagnetic shielding capability: the metallized layer can suppress electromagnetic interference (EMI) and improve signal integrity.

3. Wide environmental adaptability

Chemical corrosion resistance: acid and alkali resistant, salt spray corrosion resistant, suitable for chemical industry, Marine and other harsh environment (oil drilling sensors).

Radiation resistance: special doping process can improve radiation resistance, used in satellite and nuclear industry electronic devices.

• Key technical indicators in industrial applications

1. Limit working parameters

Temperature range: military grade-55°C to +175°C, civil grade-40°C to +125°C.

Thermal resistance (ΘJA): Typical value 35-50°C/W, supports medium power chip heat dissipation requirements.

2. Packaging specifications

Pin count and spacing: standard pin count 8-64, spacing 2.54MM, compatible with traditional through-hole technology (THT).

Size and weight: The typical 14-pin package size is about 19MM×6.35MM, light but strong structure.

3. Reliability verification

Air tightness test: helium mass spectrometry leak detection and pressure cooker test (PCT) to ensure long-term sealing.

Life prediction: The average trouble-free time (MTBF) is calculated by ARRHENIUS model to be over 100,000 hours.

• Typical application scenarios

1. Defence and aerospace

Missile navigation system: withstand the high temperature impact and violent vibration at the moment of launch.

Satellite power management module: radiation resistant ceramic to ensure long-term stable operation in space environment.

2. Industrial control and energy

Downhole sensors: continuously monitor oil and gas parameters in high temperature and high pressure environment above 150°C.

Power electronic protection circuit: used for high voltage relay control module, arc and temperature fluctuation resistant.

3. Medical and special equipment

Implantable medical devices: pacemakers require high sealing to ensure more than 30 years of trouble-free operation.

Laboratory instruments: chemical corrosion resistant properties suitable for sensor packaging in precision analytical equipment.

• Future development trend

1. Material upgrade and cost optimization

Aluminum nitride ceramic replacement: thermal conductivity increased to 170 W/MK, reducing thermal resistance (target <20°C/W), suitable for high power chips.

Low cost sintering process: improve ceramic forming technology (lamination forming), reduce the cost of small and medium batch production.

2. Function integration and intelligence

Embedded passive components: resistors and capacitors are integrated through LTCC (low temperature co-fired ceramic) technology to simplify peripheral circuits.

Intelligent sensor fusion: temperature and pressure sensors are integrated in the package to realize self-monitoring function (industrial equipment health diagnosis).

3. Adaptation to emerging fields

Nuclear electronic equipment: development of neutron radiation resistant doped ceramics for nuclear reactor control modules.

Deep-sea exploration equipment: high-pressure packaging design (>1000 atmospheric pressure) and electronic system integration, supporting deep-sea robot applications.

4. Green manufacturing and circular economy

Recyclable ceramic materials: develop environmentally friendly ceramic recipes to reduce carbon emissions in the manufacturing process.

Lead-free welding process: replace traditional lead-containing solder and comply with global environmental regulations (ROHS).

• Market outlook forecast

According to TECHINSIGHTS data, the global ceramic DIP packaging market size in 2023 is about $850M. It is expected that:

$1.1 billion in 2025 (CAGR 8.7%)

Breakthrough of $1.8 billion (CAGR 10.2%) by 2030

Growth drivers:

1. Global expansion of the space industry (35 per cent increase in annual launch volume of commercial satellites)
2. The need for highly reliable equipment in Industry 4.0
3. Power electronics upgrade in the field of new energy

CDIP continues to hold a significant position in the field of extreme environment electronics due to its irreplaceable reliability. Despite competition from surface mount technology (QFP, BGA), CDIP will continue to thrive in high-reliability scenarios through material innovations (aluminum nitride), functional integration (LTCC), and expansion into emerging fields (nuclear energy, deep-sea exploration). It will become a key packaging choice for military, energy, and medical equipment. Future development will focus on high performance, multifunctionality, and environmental compatibility, solidifying its position in the high-value-added market.