High sensitivity, low power consumption, Multimodal —— defines the ultimate paradigm of the next generation of sensors
Deepetch Semicon, acting as the “nerve endings” of modern sensors, are driving a leap in sensing technology from “signal acquisition” to “intelligent decision-making” through nanoscale innovations. By integrating MEMS microelectromechanical systems with CMOS-IS technology, chips can integrate sensing, computing, and communication functions within a millimeter square space, boosting sensitivity to picometer levels (10^-¹² meters) and reducing power consumption by 90%, thus completely breaking the limitations of traditional sensors—low precision, slow response, and limited application scenarios. Millimeter-wave radar chips, incorporating antenna arrays and AI acceleration cores, can accurately detect subtle movements of objects at the 0.1 mm level in rain, snow, and fog, enabling contactless gesture control in smart homes; image sensors equipped with dual-layer transistor pixel technology improve signal-to-noise ratios eightfold in low-light conditions, allowing security cameras to achieve full-color imaging at an illumination level of 0.0005 LUX.
Technological innovation drives the three major dimensions of evolution
- Extreme perception:
The multi-spectral sensor based on the quantum dot photoelectric chip can analyze 16 light segments at the same time, and the crop nutrient detection accuracy reaches 99.7%;
Using the MEMS accelerometer of piezoelectric thin film chip, the resolution exceeds 10NG / HZ, and the response speed of the earthquake early warning system is reduced to 0.1 seconds.
- Edge intelligence:
Integrated 8-core BPU reduces the processing delay of lidar point cloud to 3 milliseconds, and improves the decision efficiency of autonomous driving decision-making by 5 times;
BME688 Environmental sensor is embedded with gas recognition AI model, 9 can detect 3000 kinds of volatile organic compounds (VOCS), and the industrial leakage detection efficiency is increased by 40%.
- Multimodal fusion:
Integrating temperature and humidity, air pressure and motion sensing, the wearable device can calculate blood oxygen saturation (SPO₂) in real time with an error rate of less than 1%;
Inertial module integrates machine learning core, and industrial robot can predict bearing faults through vibration spectrum, reducing maintenance cost by 60%.
Industrial inspection 4.0: it can scan 500 labels per second in the metal environment, and improve the efficiency of supply chain management by 90%;
Environmental monitoring: The UAV carrier system based on gallium nitride (GAN) gas sensor chip completes 10 square kilometers PM2.53 D modeling in 1 hour, and the accuracy exceeds the national standard by 20 times.
With the breakthrough of 2D material chip (such as graphene ion-sensitive sensor) and THz wave chip, the boundary of the sensor is being redefined. —— Bionic electronic skin can sense 0.1 KPA pressure changes, comparable to human touch sensitivity; THz imaging chip penetrates 50 layers of fiber to detect subcutaneous cancer cells, and the misdiagnosis rate is reduced to 0.01%. From the “data tentacles” of the factory workshop to the “digital doctor” of the human body, the continuous evolution of semiconductor chips is building an intelligent world where “everything can be felt, everything is known”.
