We provide an integrated solution of “materials + devices + equipment”:
Semiconductor equipment: high-precision wafer bonding machine (± 5 Μ M alignment accuracy), ceramic sintering furnace (1600℃ uniform temperature control)
Materials and devices: silicon defect density (<100CM ²) and customized loading plates
Value point: Customers can improve the efficiency of the whole process from material processing to device packaging by 40%, and the yield is stable at more than 98.5%.
