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    The UAV requires extremely high material weight and high temperature resistance. How can your third-generation semiconductor materials (such as SIC / GAN) meet these requirements?

    Designed for a harsh drone environment:

    Lightweight: The density of ceramic carrier plate is 40% lower than that of traditional metal, which helps reduce the weight and improve the endurance of UAV.

    High temperature tolerance: can operate stably from-60°C to 350°C, suitable for engine compartment/motor high temperature area.

    High frequency response: the signal transmission delay is lower than 0.1NS, improving the real-time performance of the flight control system.

    Value proposition: Choose us = longer flight time + more reliable extreme environment performance.

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