We adopt a military-grade manufacturing system:
1.Nanoscale molding: the thickness tolerance is controlled at ± 0.8 Μ M (in accordance with MIL-PRF-55342)
2.Laser direct writing metallization: line width accuracy of 5 Μ M, adapted to meet the photonic integrated circuit (PIC) packaging requirements
3.Vacuum brazing process: helium leakage rate <110 ⁹ PA · M³ / S, ensuring the long-term vacuum of the optical cavity (based on the ISO 10110 standard test)
Not applicable to the X-ray extreme radiation environment
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