We adopt a military-grade manufacturing system:
1.Nanoscale molding: the thickness tolerance is controlled at ± 0.8 Μ M (in accordance with MIL-PRF-55342)
2.Laser direct writing metallization: line width accuracy of 5 Μ M, adapted to meet the photonic integrated circuit (PIC) packaging requirements
3.Vacuum brazing process: helium leakage rate <110 ⁹ PA · M³ / S, ensuring the long-term vacuum of the optical cavity (based on the ISO 10110 standard test)
Not applicable to the X-ray extreme radiation environment
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
