Our zirconium oxide (ZRO ₂) ceramic shell adopts nanoscale surface polishing technology, with surface roughness <0.01 Μ M, combined with 1 co-crystal sealing process, with air tightness of 10 ^ -9 PA · M³ / S (helium leak detection standard), which can be adapted to C band (insertion loss <0.1DB-1565 NM) of 400G / 800G optical module. After purchase, it provides third-party air tightness authentication and multi-channel optical coupling calibration services, compatible with LUMENTUM, II-VI and other mainstream laser chips.
The SCH Series is a high-performance DAF/DDAF (Die Attach Film) designed to streamline and enhance the advanced packaging process....
The DEEPETCH DP-QPA2611 is a high-performance X-Band (8–12 GHz) Gallium Nitride (GaN) Power Amplifier...
The DEEPETCH DP-ROS-40121 is a premium, solvent-free epoxy die attach adhesive engineered for the most...
The Diamond Heat Spreader is a highly efficient thermal management material engineered for the most demanding...
Molybdenum copper composite: adjustable CTE, high conductivity, lower density than tungsten copper. No...
Tungsten copper composite: low CTE, high conductivity. Ideal for RF, power, optical packaging.
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
