Our zirconium oxide (ZRO ₂) ceramic shell adopts nanoscale surface polishing technology, with surface roughness <0.01 Μ M, combined with 1 co-crystal sealing process, with air tightness of 10 ^ -9 PA · M³ / S (helium leak detection standard), which can be adapted to C band (insertion loss <0.1DB-1565 NM) of 400G / 800G optical module. After purchase, it provides third-party air tightness authentication and multi-channel optical coupling calibration services, compatible with LUMENTUM, II-VI and other mainstream laser chips.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
Equipment features: 1. Non-destructive precision testing Micrometer-level probe contact technology...
