跳到内容
Products & Service
Wafer raw materials
Substrate material
Ceramic Package
IC packaging substrates
Equipment
Sensor chip series
Silicon wafer
Monocrystalline silicon
Polysilicon
Epitaxial Silicon
Compound semiconductor wafers
Gallium Arsenide (GaAs)
Indium Phosphide (InP)
Gallium Nitride (GaN)
Silicon Carbide (SiC)
Oxide semiconductor wafer
Zinc Oxide (ZnO)
Indium Tin Oxide (ITO)
Compound Semiconductors
Cadmium Telluride (CdTe)
Aluminum Arsenide (AiAs)
Indium Arsenide (InAs)
Other Materials
Germanium
Silicon-germanium (SiGe)
Graphene
Fourth generation semiconductor materials
Diamond
Glass
Glass Wafer
Silicon on Insulator
(Soi)
Substrate Material
Ceramic Substrate
Alumina
Aluminum Nitride (AIN)
Zirconia
Silicon Nitride
Multilayer ceramic
Inorganic substrate
Glass substrate
Metal substrate
Copper substrate
Aluminum substrate
Organic substrate
FR-4 (glass fiber reinforced epoxy resin)
ABF substrate (Epoxy Deposited Film)
BT resin (bismaleimide triazine resin)
Ceramic Dual In-line Package (CDIP)
Butterfly Package
Ceramic Quad Flat Package (CQFP)
Ceramic Pin Grid Array Package (CPGA)
Ceramic Small Outline Package (CSOP)
Ceramic Leadless Chip Carrier Package (CLCC)
Ceramic Ball Array (CBGA)
Ceramic SOP
Ceramic DIP
Ceramic QFP
FCBGA Substrate
FCCSP Substrate
SAP Process
mSAP Process
Tenting process
Coreless Process
Maskless Lithography/LDI-laser direct imager
Mask Aligner
Wet etching equipment
ICP RIE System (III-V and Metal Etching)
Deep RIE System (SiOx, SiNx and Deep Si Etching)
PECVD (Plasma Enhanced Vapour Deposition System andGas System for Etching&PECVD Systems
Optical Microscopes
DC–RF Sputter System
E-beam Evaporation System
ALD System (Atomic Layer Deposition)
Automatic Dicing Saw Machine
Oxygen Plasma System
Probe station
AOI test equipment
Ellipsometers
Reflectometer
Packaging equipment
X-RAY testing equipment
X-RAY point equipment
Electroplating equipment
Glovebox System
High temperature furnace
Vacuum furnace
Tunnel furnace
Rapid Thermal Annealer
Wafer polishing equipment
Wafer thinning device
Raman Microscope and Spectrometer RAMAN
Wire&Die Bonder Machine
Scanning Electron Microscope&EDS-Energy Dispersive Spectrometer
Sensor chip series
Customizable sensor series
IDM
Industry
Solutions
Solutions
industry
Healthcare
Aerospace
Automotive
Al Industry
Communications Industry
Optical Applications
Sensor Industry
Drone Industry
About Us
Contact Us
News Center
New
Blog
Chips In-stock
X
Home
Products Center
ABF substrate (epoxy resin deposited film)
Alumina Ceramic Substrate
Aluminium Arsenide (AiAs)
Aluminium Nitride (AIN)
Aluminum Substrate
BT resin (bismaleimide triazine resin)
Butterfly package
Cadmium Telluride (CdTe)
Ceramic ball array housing (CBGA)
Ceramic double row direct insertion package (CDIP)
Ceramic four-sided lead flat package (CQFP)
Ceramic leadless chip carrier housing (CLCC)
Ceramic needle grid matrix encapsulated (CPGA)
Ceramic small form factor packaged (CSOP)
Copper Substrate
Diamond
Epitaxial silicon
FR-4 (glass fiber reinforced epoxy resin)
Gallium Arsenide (GaAs)
Gallium Nitride (GaN)
Germanium
Glass Substrate
Glass wafer
Graphene
Indium Arsenide (InAs)
Indium phosphide (InP)
Indium Tin Oxide (ITO)
Monocrystalline silicon
Multilayer Ceramic Carrier
Polycrystalline silicon
Pottery and porcelain DIP
Pottery and porcelain QFP
Pottery and porcelain SOP
Silicon And Germanium (SiGe)
Silicon Carbide (SiC)
Silicon Nitride
Silicon On Insulators (Soi)
Zinc Oxide (ZnO)
Zirconia
IDM
About Us
Contact Us
About DEEPETCH
Company Overview
News Center
Blog
New
Chips In-stock
Industry
Aerospace
AI Industry
Automotive
Communications Industry
Drone Industry
Healthcare
Optical Applications
Sensor Industry
Solutions
X
News Center
Home
News Center
Category
Blog
1
New
1
Related News
What Role Do Patch Cables Play in Reliable Optical Communication Systems
In today’s digital economy, the backbone of data centers and long-haul networks is no longer built on...
Why Do IC Substrate Manufacturers Trust mSAP and SAP for Long Term Reliability
IC substrates have become the backbone of advanced semiconductor packaging. They connect chips to larger...
What Is the Optical Speed Revolution for Future Data Centers
Data centers power your digital world, from streaming videos to training AI models. Enter the optical...
Why High-Speed Optical Communication is Critical for Data Centers
In today’s fast-moving digital world, the way data travels defines the strength of every data center....
No posts found
Search
How to solve the problem of heat dissipation of high-power semiconductor laser?
2025-03-25
Aluminum nitride (ALN) ceramic thermal sinking substrate adopts gradient cofiring process, thermal conductivity...
How much comprehensive cost can be reduced by using your scheme?
2025-03-25
Customer case data shows that: Lidar emission module yield increased by 22% (thanks to the thermal expansion...
How to ensure the packaging accuracy of ceramic tube shell?
2025-03-25
We adopt a military-grade manufacturing system: 1.Nanoscale molding: the thickness tolerance is controlled...
How can the third generation of semiconductor materials improve the performance of high-power lasers?
2025-03-25
Our ALN ceramic substrate and GAN-ON-SIC scheme have achieved three major breakthroughs: 1.Thermal management...
What substantial benefits can be brought to the satellite project from selecting your products?
2025-03-25
Based on the customer tracking data, our scheme can be implemented by: 1.The communication module is...
How does the ceramic packaging match the requirements of different satellite platforms?
2025-03-25
We offer modular packaging solutions: Standardized component library: covering 7 standard dimensions...
How to ensure that each batch of products meets the space-class reliability?
2025-03-25
We implement a three-level space quality control system: 1.Gene screening: LIBS laser spectroscopy was...
Why are third-generation semiconductor materials more suitable for satellite communication systems?
2025-03-25
Our gallium nitride (GAN) -based materials have three breakthrough advantages over traditional silicon-based...
If you encounter technical problems, can you get rapid technical support?
2025-03-25
We provide drone industry-specific services: 724-hour response: issue a preliminary solution to emergency...
1
2
3
4
5
6
