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Epitaxial Wafer（EPI）
Oxide semiconductor wafer
Zinc Oxide (ZnO)
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Compound Semiconductors
Cadmium Telluride (CdTe)
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Indium Arsenide (InAs)
Other Materials
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Multilayer ceramic
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Organic substrate
FR-4 (glass fiber reinforced epoxy resin)
ABF substrate (Epoxy Deposited Film)
BT resin (bismaleimide triazine resin)
Thermal Management Composites
Diamond Copper Composite (Cu-Diamond)
Tungsten Copper Composite (W-Cu)
Molybdenum Copper Composite (Mo-Cu)
Diamond Heat Spreader
Ceramic Dual In-line Package (CDIP)
Butterfly Package
Ceramic Quad Flat Package (CQFP)
Ceramic Pin Grid Array Package (CPGA)
Ceramic Small Outline Package (CSOP)
Ceramic Leadless Chip Carrier Package (CLCC)
Ceramic Ball Array (CBGA)
Ceramic SOP
Ceramic DIP
Ceramic QFP
Substrates & Processes
FCBGA Substrate
FCCSP Substrate
SAP Process
mSAP Process
Tenting process
Coreless Process
Die Interconnect & Attach
High Thermal Silver Adhesive
DAF/DDAF Die Attach Film
Maskless Lithography/LDI-laser direct imager
Mask Aligner
Wet etching equipment
ICP RIE System (III-V and Metal Etching)
Deep RIE System (SiOx, SiNx and Deep Si Etching)
PECVD (Plasma Enhanced Vapour Deposition System andGas System for Etching&PECVD Systems
Optical Microscopes
DC–RF Sputter System
E-beam Evaporation System
ALD System (Atomic Layer Deposition)
Automatic Dicing Saw Machine
Oxygen Plasma System
Probe station
AOI test equipment
Ellipsometers
Reflectometer
Packaging equipment
X-RAY testing equipment
X-RAY point equipment
Electroplating equipment
Glovebox System
High temperature furnace
Vacuum furnace
Tunnel furnace
Rapid Thermal Annealer
Wafer polishing equipment
Wafer thinning device
Raman Microscope and Spectrometer RAMAN
Wire&Die Bonder Machine
Scanning Electron Microscope&EDS-Energy Dispersive Spectrometer
Sensor Chip Series
Sensor chip series
Customizable sensor series
In Stock Chip
X-Band GaN PA MMIC
IDM
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ABF substrate (epoxy resin deposited film)
Alumina Ceramic Substrate
Aluminium Arsenide (AiAs)
Aluminium Nitride (AIN)
Aluminum Substrate
BT resin (bismaleimide triazine resin)
Butterfly package
Cadmium Telluride (CdTe)
Ceramic ball array housing (CBGA)
Ceramic double row direct insertion package (CDIP)
Ceramic four-sided lead flat package (CQFP)
Ceramic leadless chip carrier housing (CLCC)
Ceramic needle grid matrix encapsulated (CPGA)
Ceramic small form factor packaged (CSOP)
Copper Substrate
Diamond
Epitaxial silicon
FR-4 (glass fiber reinforced epoxy resin)
Gallium Arsenide (GaAs)
Gallium Nitride (GaN)
Germanium
Glass Substrate
Glass wafer
Graphene
Indium Arsenide (InAs)
Indium phosphide (InP)
Indium Tin Oxide (ITO)
Monocrystalline silicon
Multilayer Ceramic Carrier
Polycrystalline silicon
Pottery and porcelain DIP
Pottery and porcelain QFP
Pottery and porcelain SOP
Silicon And Germanium (SiGe)
Silicon Carbide (SiC)
Silicon Nitride
Silicon On Insulators (Soi)
Zinc Oxide (ZnO)
Zirconia
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