Our products use the third generation of semi-semiconductor materials (such as silicon carbide, gallium nitride) and high-purity ceramic composite materials, through:
10 0,000 hour life test: simulate space radiation, extreme temperature (-200℃ to 1000℃) and vibration environment to ensure long-term stable operation.
Military-grade packaging process: the sealing is IP69K, corrosion resistant and impact resistant.
Customer value: reduce the failure rate of aerospace equipment, extend the maintenance cycle, and ensure the success rate of missions
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
Equipment features: 1. Non-destructive precision testing Micrometer-level probe contact technology...
