跳到内容
Products Center
Wafer raw materials
Ceramic substrate material
Ceramic shell
Silicon wafer
Monocrystalline silicon
Polysilicon
Epitaxial Silicon
Compound semiconductor wafers
Gallium Arsenide (GaAs)
Indium Phosphide (InP)
Gallium Nitride (GaN)
Silicon Carbide (SiC)
Oxide semiconductor wafer
Zinc Oxide (ZnO)
Indium Tin Oxide (ITO)
Compound Semiconductors
Cadmium Telluride (CdTe)
Aluminum Arsenide (AiAs)
Indium Arsenide (InAs)
Other Materials
Germanium
Silicon-germanium (SiGe)
Graphene
Fourth generation semiconductor materials
Diamond
Glass
Glass Wafer
Silicon on Insulator
(Soi)
Substrate Material
Ceramic Substrate
Alumina
Aluminum Nitride (AIN)
Zirconia
Silicon Nitride
Multilayer ceramic
Inorganic substrate
Glass substrate
Metal substrate
Copper substrate
Aluminum substrate
Organic substrate
FR-4 (glass fiber reinforced epoxy resin)
ABF substrate (Epoxy Deposited Film)
BT resin (bismaleimide triazine resin)
Ceramic Dual In-line Package (CDIP)
Butterfly Package
Ceramic Quad Flat Package (CQFP)
Ceramic Pin Grid Array Package (CPGA)
Ceramic Small Outline Package (CSOP)
Ceramic Leadless Chip Carrier Package (CLCC)
Ceramic Ball Array (CBGA)
Ceramic SOP
Ceramic DIP
Ceramic QFP
IDM
Industry
Solutions
Solutions
industry
Healthcare
Aerospace
Automotive
Al Industry
Communications Industry
Optical Applications
Sensor Industry
Drone Industry
About Us
Contact Us
News Center
New
Blog
Chips In-stock
X
Home
Products Center
ABF substrate (epoxy resin deposited film)
Alumina Ceramic Substrate
Aluminium Arsenide (AiAs)
Aluminium Nitride (AIN)
Aluminum Substrate
BT resin (bismaleimide triazine resin)
Butterfly package
Cadmium Telluride (CdTe)
Ceramic ball array housing (CBGA)
Ceramic double row direct insertion package tube shell (CDIP)
Ceramic four-sided lead flat package tube (CQFP)
Ceramic leadless chip carrier housing (CLCC)
Ceramic needle grid matrix encapsulated tube shell (CPGA)
Ceramic small form factor packaged tube shell (CSOP)
Copper Substrate
Diamond
Epitaxial silicon
FR-4 (glass fiber reinforced epoxy resin)
Gallium Arsenide (GaAs)
Gallium Nitride (GaN)
Germanium
Glass Substrate
Glass wafer
Graphene
Indium Arsenide (InAs)
Indium phosphide (InP)
Indium Tin Oxide (ITO)
Monocrystalline silicon
Multilayer Ceramic Carrier
Polycrystalline silicon
Pottery and porcelain DIP
Pottery and porcelain QFP
Pottery and porcelain SOP
Silicon And Germanium (SiGe)
Silicon Carbide (SiC)
Silicon Nitride
Silicon On Insulators (Soi)
Zinc Oxide (ZnO)
Zirconia
IDM
About Us
Contact Us
About DEEPETCH
Company Overview
News Center
Blog
New
Chips In-stock
Industry
Aerospace
AI Industry
Automotive
Communications Industry
Drone Industry
Healthcare
Optical Applications
Sensor Industry
Solutions
X
News Center
Home
News Center
Category
Blog
1
New
1
Related News
Does ceramic material performance decay in high temperature sterilization scenario?
The ceramic components of alumina (AL₂O₃) surgical instruments can withstand up to 1400℃ through gradient...
Does the product meet the FDA and EU MDR medical certification requirements?
The whole system of materials passes FDA 21 CFR 820, EU MDR ANNEX XV and ISO 13485 system certification,...
How to respond to the small-batch customization needs of medical device manufacturers?
We adopt the modular flexible production line (minimum starting order of 50 pieces) and AI rapid proofing...
How does the ceramic carrier board fit into the precision integration requirements of miniaturized medical sensors?
Using 3D printed silicon nitride (SI₃N₄) substrate technology, it supports microchannel structures with...
No posts found
Search
Does ceramic material performance decay in high temperature sterilization scenario?
2025-03-25
The ceramic components of alumina (AL₂O₃) surgical instruments can withstand up to 1400℃ through gradient...
Does the product meet the FDA and EU MDR medical certification requirements?
2025-03-25
The whole system of materials passes FDA 21 CFR 820, EU MDR ANNEX XV and ISO 13485 system certification,...
How to respond to the small-batch customization needs of medical device manufacturers?
2025-03-25
We adopt the modular flexible production line (minimum starting order of 50 pieces) and AI rapid proofing...
How does the ceramic carrier board fit into the precision integration requirements of miniaturized medical sensors?
2025-03-25
Using 3D printed silicon nitride (SI₃N₄) substrate technology, it supports microchannel structures with...
Can ceramic tube shells meet the long-term biocompatibility requirements of implantable medical devices?
2025-03-25
Zirconia (ZRO ₂) ceramic tube shell by nano-scale surface polishing process, surface roughness <0.05...
How to ensure safety and reliability of third-generation semiconductor materials in medical devices?
2025-03-25
Gallium nitride (GAN) power module adopts high temperature co-fired ceramic (HTCC) packaging technology,...
How to reduce the BOM cost of the vehicle by using your scheme?
2025-03-25
Collaborative innovation through Materials-Process-design: 1.Volume of motor controller reduced by 40%...
How does the ceramic tube shell meet the high-frequency signal requirements of the ADAS sensor?
2025-03-25
We provide special solutions for millimeter-wave radar: 1.Stable dielectric constant: 77 GHZ frequency...
How to deal with the high cost of SIC power devices?
2025-03-25
Through AI optimization of the substrate cutting process (30% increase in wafer utilization rate of 30%)...
1
2
3
4
5
6
