Molybdenum copper is a composite material of molybdenum and copper, Its performance is similar to that of tungsten copper, and it also has adjustable thermal expansion coefficient and thermal conductivity. However, the density of molybdenum copper is much smaller than that of tungsten copper, making it more suitable for aerospace and other fields.
| Product Name | Component | Average linear expansion coefficient [ppm/K] RT~400℃ | Thermal conductivity [W/(m·k)] | Mass Density [g/cm³] | Relative density [%T.D.] |
|---|---|---|---|---|---|
| Mo85 | Mo85Cu15 | 6.0~7.0 | ≥ 140 | 10.0 ± 0.2 | ≥ 99 |
| Mo80 | Mo80Cu20 | 6.5~7.5 | ≥ 150 | 9.9 ± 0.2 | ≥ 99 |
| Mo70 | Mo70Cu30 | 6.7~8.2 | ≥ 170 | 9.7 ± 0.2 | ≥ 99 |
| Mo65 | Mo65Cu35 | 7.8~9.3 | ≥ 180 | 9.65 ± 0.2 | ≥ 99 |
| Mo60 | Mo60Cu40 | 8.5~9.5 | ≥ 190 | 9.6 ± 0.2 | ≥ 99 |
| Mo55 | Mo55Cu45 | 10.5~11.5 | ≥ 200 | 9.55 ± 0.2 | ≥ 99 |
| Mo50 | Mo50Cu50 | 10.5~11.5 | ≥ 200 | 9.5 ± 0.2 | ≥ 99 |
Aerospace & Flight Electronics – Thermal management components where weight reduction is critical.
RF & Microwave – Heat spreaders and packages for high-power amplifiers.
Power Semiconductors – Substrates and heat sinks for IGBT, SiC, and GaN modules.
Optical Communication – Laser diode and photodetector packaging.
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Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
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