This metal matrix composite serves dual roles in chip-level packaging: providing structural support as a substrate, and acting as a high-performance heat spreader to dissipate heat from high-power chips.
Diamond-Aluminum Thermally Conductive Composite is an advanced material designed to address thermal challenges in weight-sensitive, high-reliability applications. By uniformly dispersing diamond particles within an aluminum matrix, it achieves a unique combination of high thermal conductivity, low density, and a low coefficient of thermal expansion (CTE)—making it an ideal heat spreader and packaging material for aerospace, electric vehicles, and data center electronics.
High Thermal Conductivity – Efficiently spreads and dissipates heat from high-power density devices.
Low Density – Lightweight aluminum matrix reduces overall system weight, critical for aerospace and automotive applications.
Low CTE – Matches the thermal expansion of common semiconductor materials, minimizing thermal stress.
Excellent Mechanical Strength – Withstands vibration and thermal cycling without deformation.
Reliable Thermal Stability – Performs consistently over repeated thermal shocks.
Good Surface Finish – Low surface roughness and high parallelism for direct bonding.
| Parameter | Value | Unit | Test Method |
|---|---|---|---|
| Thickness | > 0.5 | mm | / |
| Density | 3.0 | g cm⁻³ | ASTM B311 |
| Surface Roughness | < 0.5 | µm | ASTM D7363 |
| Parallelism | < 0.02 | mm | / |
| Bending Strength | > 300 | MPa | ASTM A370 |
| Thermal Conductivity | > 600 | W/m·K | ASTM E1461 |
| CTE | < 6.5 | ppm/K | ASTM E831 |
| Thermal Stability | -65 to +150°C, 1000 thermal shocks, <5% degradation | / | / |
Aerospace – Thermal management for avionics, satellite electronics, and high-reliability systems.
Automotive – Power modules, battery thermal management, and EV inverters.
Data Centers – Heat spreaders for high-performance processors, ASICs, and optical transceivers.
High-Reliability Electronics – RF power amplifiers, laser diodes, and power converters.
Tungsten copper composite: low CTE, high conductivity. Ideal for RF, power, optical packaging.
Diamond-aluminum composite for advanced thermal management. Lightweight, high thermal conductivity, low...
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
