Tungsten Copper Composite

Name: Tungsten Copper Composite
Brand: DEEPETCH

Tungsten copper is a type of metal composite material that combines the low thermal expansion of tungsten with the high thermal and electrical conductivity of copper, Moreover, its material properties can be tailored through composition design to meet specific requirements. Tungsten copper materials can establish favorable thermal expansion coefficient matching with ceramics, composites, semiconductor materials, and others. This makes them commonly employed in the electronic package and heat dissipation materials for radiofrequency and microwave applications, power semiconductor devices, as well as optical communication devices.

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Product Feature

No sintering activation elements such as Fe and Co are added to maintain high thermal conductivity
Excellent air tightness
Supplying semi-finished products or surfaces coated with nickel (Ni), palladium (pd), gold (Au), silver (Ag), copper (cu), and other coatings.
Good size control, surface finish and flatness

W-Cu Material Common Specifications

Product Name	Component	Average linear expansion coefficient [ppm/K] ~400℃	Thermal conductivity [W/(m·k)]	Mass Density [g/cm³]	Relative density [%T.D.]
W90	W90Cu10	6.0~7.0	≥ 170	17.0 ± 0.3	≥ 99
W88	W88Cu12	6.1~7.1	≥ 175	16.9 ± 0.3	≥ 99
W87	W87Cu13	6.2~7.2	≥ 180	16.7 ± 0.3	≥ 99
W85	W85Cu15	6.4~7.4	≥ 190	16.4 ± 0.3	≥ 99
W83	W83Cu17	6.6~7.6	≥ 200	16.1 ± 0.3	≥ 99
W80	W80Cu20	7.4~8.9	≥ 210	15.6 ± 0.3	≥ 99
W75	W75Cu25	9.3~10.2	≥ 215	14.98 ± 0.3	≥ 99
W70	W70Cu30	9.3~10.2	≥ 220	14.3 ± 0.3	≥ 99
W50	W50Cu50	11.5~13.0	≥ 240	12.2 ± 0.3	≥ 99
W90L	W90Cu10L	6.1~7.1	≥ 180	16.8 ± 0.3	≥ 99
W85L	W85Cu15L	6.4~7.4	≥ 200	15.4 ± 0.2	≥ 99
W80L	W80Cu20L	7.4~8.9	≥ 220	15.4 ± 0.3	≥ 99

Application Areas

RF & Microwave – Heat spreaders, packages, and bases for high-power amplifiers and transceivers.

Power Semiconductors – IGBT, SiC, and GaN module substrates and heat sinks.

Optical Communication – Laser diode and photodetector packaging for stable thermal management.

Aerospace & High-Reliability Systems – Thermal management components requiring low expansion and high conductivity.

IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

01

Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

02

MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

03

We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

01

Electronic manufacturing services and printed circuit board assembly.

02

EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

03

PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.