The DEEPETCH DP-ROS-40121 is a premium, solvent-free epoxy die attach adhesive engineered for the most demanding high-power semiconductor applications. Featuring an ultra-high silver content of up to 95%, it delivers an exceptional thermal conductivity of 25 W/(m·K), ensuring rapid heat dissipation for high-power devices. Backed by a low-moisture-absorption resin system, the DP-ROS-40121 exhibits outstanding thermal resistance stability under extreme thermal shock cycles and multiple reflow soldering processes, significantly outperforming conventional silver pastes in long-term reliability.
• Ultra-High Thermal Conductivity: 95% silver filler provides a thermal conductivity of 25 W/(m·K), superior to conventional 75-80% silver pastes.
• Exceptional Thermal Stability (Low Thermal Resistance Change): Demonstrates a nearly flat thermal resistance curve (0-10% change) after 500 thermal shock cycles, whereas conventional silver pastes can degrade by over 50%.
• High Process Reliability: Withstands up to 3 reflow cycles with high stability. Passes rigorous Thermal Cycling Testing (TCT: -60°C to 150°C, 30 mins each).
• Solvent-Free System: 100% solid content epoxy formulation, eliminating outgassing and voiding issues during the curing process.
• Low Moisture Absorption: Advanced resin system ensures high reliability and prevents delamination in humid environments.
• Power Semiconductors: Ideal for IGBT and Silicon Carbide (SiC) high-power devices requiring efficient heat dissipation.
• Advanced Packaging: Suitable for SIP (System in Package) and QFN packaging.
• Automotive Electronics: Automotive power ICs and high-reliability electronic control units.
• High-Power LEDs: Provides excellent thermal management for high-brightness LED packaging.
• Substrates: Strong adhesion to ceramic and glass substrates.
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Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
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