The Diamond Heat Spreader is a highly efficient thermal management material engineered for the most demanding high-power electronic devices. Featuring extremely high thermal conductivity and exceptional thermal stability, it rapidly transfers heat away from the heat source, significantly reducing the device’s operating temperature while improving overall system stability and lifespan.
With a thermal conductivity reaching up to 2000 W/m·K—which is 5 times that of copper and 10 times that of aluminum—diamond heat spreaders offer unparalleled heat dissipation performance.
| Item | Specification |
|---|---|
| Vickers Hardness | 6500 ~ 10000 kg/mm² |
| Density | 3.51 g/cm³ |
| Young’s Modulus | 1000 ~ 1100 GPa |
| Thermal Conductivity | 800 ~ 2000 W/m·K |
| CTE (at 300K) | 1.0 ± 0.1 ppm/K |
| CTE (at 1000K) | 4.4 ± 0.1 ppm/K |
| Poisson’s Ratio | 0.1 |
| Parallelism | < 4 μm/cm |
| Thickness Tolerance | ± 50 μm |
| Surface Roughness (Growth Side) | < 100 nm Ra |
| Surface Roughness (Nucleation Side) | < 30 nm Ra |
| Dimensions | Single Crystal ≤ 25×25 mm; Polycrystalline ≤ 50 mm; Customizable |
| Standard Thickness | 300 μm |
| Chemical Stability | Acid and alkali resistant |
Designed to meet the rigorous thermal management requirements of advanced electronics, the Diamond Heat Spreader is widely used in:
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Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
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