DP-QPA2611 X-Band GaN PA MMIC

The DEEPETCH DP-QPA2611 is a high-performance X-Band (8–12 GHz) Gallium Nitride (GaN) Power Amplifier MMIC, manufactured using an advanced 0.15μm GaN-on-SiC process. Delivering a saturated output power of 5W (>37 dBm) with exceptional power-added efficiency (PAE >42%), it is the ideal building block for next-generation Active Electronically Scanned Arrays (AESA). Housed in a compact 5×5 mm QFN package, it features integrated DC blocking capacitors at the I/O ports and 50Ω internal matching, drastically simplifying external circuitry and reducing the overall size of phased array T/R modules.

(Note: The DP-QPA261x family also includes DP-QPA2610 (3W) and DP-QPA2612 (12W). Datasheet specifications are based on pulsed conditions. For CW operation, proper derating and enhanced thermal management are required.)

DP-QPA2611 X-Band GaN PA MMIC

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Key Features

•  QGaN15 GaN-on-SiC process , wideband X-band, suitable for phased array T/R modules.

•  Integrated DC blocking capacitors, simplifying external matching circuits and reducing phased array face size.

•  High PAE, reducing array power consumption and thermal stress.

•  Evaluation board available: DP-QPA2611EVB.

 

X-Band GaN PA MMIC Core Specifications

Item Specification
Frequency Band 8 ~ 12 GHz (X-Band)
Saturated Output Power (Psat) 5 W (>37 dBm), P1dB ≈ 38 dBm
Small-Signal Gain 26 dB (Typical), up to 35 dB under certain conditions
Drain Voltage (Vd) 24 V
Quiescent Drain Current (Idq) 105 mA
PAE > 42%
Package 5×5 mm QFN, 24-pin, I/O ports integrated DC blocking capacitors, 50Ω matched
Gate Voltage Range (Vg) −4V ~ 0V (Negative gate bias)
Storage Temperature −55 ~ +150℃; MSL3
chip

Application Areas

•  X-Band Active Electronically Scanned Array (AESA) radar

•  Electronic warfare jamming sources

•  X-Band satellite communications, point-to-point microwave communications

IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

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Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

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MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

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We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

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Electronic manufacturing services and printed circuit board assembly.

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EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

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PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.

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