1. Electronics and semiconductor devices
high frequency transistor:
Advantages: carrier mobility is 140 times that of silicon, and the operating frequency exceeds 300 GHZ (IBM 2023 prototype).
Technical indicators: Cut-off frequency (Fₜ) up to 700 GHZ, power density 1.5 W/MM (1.2 times that of GAN).
Flexible electronics:
Application: Foldable screen mobile phone (HuaweiMATE XS uses graphene heat dissipation film).
Advantages: Flexibility> 1 million times (resistance change <2%), transmittance> 97%.
2. Energy storage and conversion
Lithium-ion battery:
Graphene conductive agent: adding 1% graphene, the internal resistance of the battery is reduced by 20%, and the cycle life is increased by 30% (Ningde Times technology).
Silicon-based anode: capacity up to 2,000 MAH/G (traditional graphite anode 372 MAH/G).
Supercapacitors:
Technical indicators: energy density 30 WH/KG, power density 100 KW/KG (MAXWELL TECHNOLOGIES data).
3. Composite materials
aerospace:
Graphene reinforced aluminum matrix composites: 50% strength increase, 20% weight reduction (part of Boeing 787).
Thermal management materials: thermal conductivity increased to 400 W/ (M K) (traditional polymers <1 W/ (M K)).
Lightweight car: graphene/epoxy composite material improves impact resistance by 80% (Tesla battery case).
4. Biomedicine and sensors
biosensor:
Detection limit: 0.1 PG/ML (Novel Coronavirus antigen detection, 1000 times more sensitive than ELISA).
Response time: <5 seconds (glucose sensor).
Antibacterial dressings: The killing rate of Staphylococcus aureus by graphene oxide dressings was>99.9% (3 hours of contact).
5. Environmental engineering
Seawater desalination membrane:
Performance: water flux 200 L/ (M² H BAR), salt retention rate 99.9% (MIT 2022 annual experimental data).
Pollution adsorption: Graphene aerogel adsorbs crude oil at a weight ratio of 86 times (ExxonMobil’s offshore oil spill emergency plan).
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow:First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...