Graphene

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Application Areas

  • Industry application and technical index advantages

1. Electronics and semiconductor devices

high frequency transistor:

Advantages: carrier mobility is 140 times that of silicon, and the operating frequency exceeds 300 GHZ (IBM 2023 prototype).

Technical indicators: Cut-off frequency (Fₜ) up to 700 GHZ, power density 1.5 W/MM (1.2 times that of GAN).

Flexible electronics:

Application: Foldable screen mobile phone (HuaweiMATE XS uses graphene heat dissipation film).

Advantages: Flexibility> 1 million times (resistance change <2%), transmittance> 97%.

2. Energy storage and conversion

Lithium-ion battery:

Graphene conductive agent: adding 1% graphene, the internal resistance of the battery is reduced by 20%, and the cycle life is increased by 30% (Ningde Times technology).

Silicon-based anode: capacity up to 2,000 MAH/G (traditional graphite anode 372 MAH/G).

Supercapacitors:

Technical indicators: energy density 30 WH/KG, power density 100 KW/KG (MAXWELL TECHNOLOGIES data).

3. Composite materials

aerospace:

Graphene reinforced aluminum matrix composites: 50% strength increase, 20% weight reduction (part of Boeing 787).

Thermal management materials: thermal conductivity increased to 400 W/ (M K) (traditional polymers <1 W/ (M K)).

Lightweight car: graphene/epoxy composite material improves impact resistance by 80% (Tesla battery case).

4. Biomedicine and sensors

biosensor:

Detection limit: 0.1 PG/ML (Novel Coronavirus antigen detection, 1000 times more sensitive than ELISA).

Response time: <5 seconds (glucose sensor).

Antibacterial dressings: The killing rate of Staphylococcus aureus by graphene oxide dressings was>99.9% (3 hours of contact).

5. Environmental engineering

Seawater desalination membrane:

Performance: water flux 200 L/ (M² H BAR), salt retention rate 99.9% (MIT 2022 annual experimental data).

Pollution adsorption: Graphene aerogel adsorbs crude oil at a weight ratio of 86 times (ExxonMobil’s offshore oil spill emergency plan).

IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

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Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

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MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

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We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

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Electronic manufacturing services and printed circuit board assembly.

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EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

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PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.

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