New energy vehicles: 800V SIC inverter module (such as Tesla MODEL 3 rear drive module).
5G communication: MASSIVE MIMO AAU power amplifier (Huawei32T32R equipment).
Aerospace: Starborne phased array radar T/R components (temperature resistant-196℃ ~ +200℃).
Industrial power supply: 10KV/1000A IGBT crimping package.
High thermal conductivity (>100 W/M·K) reduces junction temperature and improves device life; low CTE (6-8×10⁻⁶/K) matches SI/SIC chips and reduces thermal stress cracking. Suitable for electric vehicle inverters, industrial frequency converters, photovoltaic inverters.
High efficiency heat dissipation, improve LED light efficiency and life, copper high reflectivity can improve LED light output efficiency, suitable for car headlights, outdoor display screens, plant lighting.
Low dielectric loss (DBC ceramic insulation layer), suitable for high frequency applications, copper’s high conductivity reduces signal loss, suitable for 5G PA module, military radar, satellite communication.
High temperature resistance, vibration resistance, suitable for harsh vehicle environment, high current carrying capacity, suitable for high power electric drive system, suitable for electric vehicle motor controller, battery management system (BMS).
Diamond-Copper Thermally Conductive Composite. High thermal conductivity, tunable CTE, robust.
The DE-CW-1310 DFB EPI wafer, a high-performance epitaxial structure designed for distributed feedback (DFB) lasers operating at 1310 nm....
Ceramic thin-filmvacuum sensor Optical gas massflowmeter Liquid mass flowmeter Force sensor MEMS...
Photoelectric sensing chip Light source chips Optical transmission and modulationchips Optical detection and receptionchips...
Using a“Detach Core”which has two-layers carrier foil structure on the surface as a core, and forming...
Tenting process is a kind of subtractive process, the process as follows: Laminating photosensitive film...
Modified Semi-Added Process abbreviated as mSAP, which can be used on the core or build-up layers, pattern...
Semi-Added Process abbreviated as SAP, using on the build-up-layer pattern forming as follow：First depositing...
The product generally adopts the pressing lamination process of semi-curing sheets , and line formation...
The products generally adopt the Build-up Film Lamination process, and the circuit formation uses the...
Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.
MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.
We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.
Electronic manufacturing services and printed circuit board assembly.
EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.
PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.
Title: Semiconductor manufacturing processes Objective: To have a certain foundation for the overall...
