Alumina Ceramic Substrate

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Application Areas

  • Industry applications
  1. Power electronics module:

IGBT module: alumina ceramic substrate is used as the insulating substrate of power module to improve heat dissipation performance and reliability.

MOSFET Module: alumina ceramic substrate is used for the packaging of high frequency power devices.

It is superior to FR-4 substrate (thermal conductivity <0.3 W/ (M·K)), supports IGBT/MOSFET heat dissipation, and the operating temperature can reach 300℃.

  1. LED package:

LED substrate: Alumina ceramic substrate is used for the packaging of LED chips to improve heat dissipation performance and life, which is 50% lower than that of aluminum nitride (thermal conductivity 200+ W/ (M·K)), meeting the needs of general lighting; light efficiency is improved by 15%, and the life is>50,000 hours.

  1. RF devices:

The dielectric loss (TANΔ<0.0002) is lower than that of plastic substrate and is suitable for 5G millimeter wave band.

  1. Automotive electronics:

The humidity resistance (85℃/85% RH) test is greater than 1000 hours through the AEC-Q200 certification.

  1. Aerospace:

Radiation resistance: anti Γ ray> 100 KGY, used in satellite power system.

 

IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

01

Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

02

MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

03

We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

01

Electronic manufacturing services and printed circuit board assembly.

02

EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

03

PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.

Semiconductor production shop environment
Semiconductor production shop environment
Semiconductor production shop environment
Semiconductor production shop environment

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