Silicon Nitride

Product album display

Application Areas

  • Industry application technical index advantages
  1. Power electronics and semiconductors:

High thermal conductivity and low thermal expansion coefficient, suitable for high power density devices (such as SIC, GAN modules), heat dissipation efficiency increased by more than 30%.

  1. Aerospace:

High temperature resistance (> 1000℃) and lightweight (density 3.2 G/CM³) are used for engine thermal protection components and satellite power systems.

Lightweight: density 3.2 G/CM³, lighter than alumina (3.9 G/CM³), suitable for aerospace weight reduction requirements.

 

  1. Mechanical manufacturing:

High hardness and wear resistance, used in ceramic bearings, turbine blades, life extended by more than 3 times.

  1. Chemicals and energy:

Corrosion resistance and resistance to molten metal are used in electrolytic cell lining and polysilicon production equipment to improve process efficiency.

  1. Biomedicine:

High biocompatibility for use in artificial joints and dental implants to reduce rejection.

  • Industries that are particularly suitable
  1. New energy vehicles: electronic control system, charging pile heat dissipation substrate (accounting for 75.8% of global demand).
  2. High frequency communication: 5G base station RF devices, millimeter wave radar, suitable for high frequency and low loss requirements.
  3. Aerospace: engine nozzles, thermal protection systems, tolerance to extreme temperatures and radiation.
  4. High-end equipment manufacturing: precision bearings, cutting tools, improve the durability of equipment.
  5. New energy and photovoltaic: Polysilicon reaction vessel, solar cell module, optimize production efficiency and reliability.

IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

01

Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

02

MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

03

We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

01

Electronic manufacturing services and printed circuit board assembly.

02

EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

03

PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.

News Center