Butterfly package

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Application Areas

  • The most suitable application scenarios
  1. Optical communication and laser technology

Lidar (LIDAR): 905NM/1550NM laser package for autonomous driving, which needs to be vibration resistant and high heat dissipation.

High-speed optical module: EML laser for 100G/400G optical communication (gas-tight and anti-oxidation).

  1. Radio frequency and microwave electronics

5G millimeter wave base station: high frequency, high power packaging (28GHZ/39GHZ) of GAN power amplifier (PA).

Satellite communication T/R module: KA-band phased array antenna module for low Earth orbit (LEO) satellite.

  1. Aerospace and defense

Electronic warfare (EW) system: X-band radar jamming package.

Missile guidance: microwave integrated circuit (MMIC) package resistant to high temperature and impact.

  1. Medical and industrial equipment

Medical laser scalpel: stable output package of high power CO₂ laser.

Industrial fiber optic sensing: photoelectric sensors in high temperature environments (oil drilling).

IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

01

Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

02

MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

03

We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

01

Electronic manufacturing services and printed circuit board assembly.

02

EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

03

PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.

Semiconductor production shop environment
Semiconductor production shop environment
Semiconductor production shop environment
Semiconductor production shop environment

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