Ceramic needle grid matrix encapsulated (CPGA)

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Application Areas

Typical application scenarios

High performance computing and data centers

Server CPU/GPU: Intel early Xeon processor, high power consumption packaging of aerospace computing module.

FPGA accelerator card: high temperature resistant design of XILINX/ALTERA high computing power chip.

Aerospace and defense

Spaceborne computer: satellite radiation resistant processor (POWERPC architecture).

Radar signal processing: beamforming IC packaging for phased array radar.

Industry and energy

Power electronics control: high voltage IGBT drive, smart grid high temperature resistant packaging.

Oil exploration equipment: downhole high temperature electronic module (>175°C).

Automotive electronics (high reliability segment)

Autonomous driving master control chip: heat dissipation optimization design of automotive-grade AI processor (NVIDIA DRIVE).

Military communication on the vehicle: RF module resistant to electromagnetic interference (EMI)

IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

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Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

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MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

03

We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

01

Electronic manufacturing services and printed circuit board assembly.

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EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

03

PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.