DE-CW-1310 DFB EPI Wafer

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Typical Epitaxy Parameters

PARAMETER	VALUES
PL Wavelength control	<5nm
PL Wavelength uniformity	Std. Dev < 1nm @inner 42mm
Thickness control	< ±3%
Thickness uniformity	< ±3% @inner 42mm
Doping control	< ±10%
P-InP doping (cm^-3)	Zn doped ; 5e17 – 2e18
N-InP doping (cm^-3)	Si doped ; 5e17 – 3e18
AllnGaAs doping (cm^-3)	1e17 – 2e18
lnGaAsP doping (cm^-3)	5e17 – 1e19
lnGaAs doping (cm^-3)	5e14 – 4e19

Typical LD Chip Parameters

PARAMETER	SYMBOL	TYP	UNIT
Peak Wavelength	λp	1310 ± 3	nm
Threshold Current	Ith	< 15	mA
Front Power	Po	> 9	mW
Slope Efficiency	η	> 0.45	W / A
Series Resistance	Rs	< 5	Ohm
Band Width	SMSR	> 35	dB

Application Areas

high-speed optical communication
LiDAR

IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

01

Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

02

MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

03

We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

01

Electronic manufacturing services and printed circuit board assembly.

02

EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

03

PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.