Diamond-Copper Thermally Conductive Composite

The SMARTNOBLE Diamond-Copper Thermally Conductive Composite is a high-performance material designed to solve the most demanding thermal challenges in modern electronic systems. By uniformly dispersing diamond particles within a copper matrix, this composite achieves a unique combination of ultra-high thermal conductivity, high mechanical strength, and a tunable coefficient of thermal expansion (CTE)—making it an ideal heat spreader and packaging material for high-power devices.

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Key Advantages

High Thermal Conductivity– Efficiently spreads and dissipates heat from high-power density devices such as IGBTs, GaN transistors, laser diodes, and high-brightness LEDs, reducing junction temperatures and extending service life.
High Strength – Provides excellent mechanical robustness, withstanding thermal cycling, vibration, and assembly stresses without cracking or deformation.Tunable CTE – Can be tailored to match the CTE of common semiconductor materials (e.g., Si, GaAs, SiC, Al₂O₃, AlN), minimizing thermal stress and improving reliability in chip packaging and power modules.
Reliable Thermal Stability – Endures 1000 thermal shock cycles between -65°C and +150°C with less than 5% performance degradation, ensuring long-term reliability in harsh environments.
Customizable – Available in different thicknesses, thermal conductivities, and CTE values to meet specific design requirements.

Common Specifications

Item	Parameter	Unit	Test Standard
Density	6.25	g cm⁻³	ASTM B311
Flexural Strength	> 300	MPa	ASTM A370
Thermal Conductivity	> 900	W m⁻¹ K⁻¹	ASTM E1461
Thermal Expansion	5 ~ 10	ppm K⁻¹	ASTM E831
Thermal Stability	1,000 thermal shocks from -65 to 150 °C, performance degradation < 5%
Brazing Performance	Can be copper-silver brazed
Enables the fabrication of diamond-copper composites with different thicknesses, thermal conductivities, and coefficients of thermal expansion.

Application Areas

Power Electronics – IGBT modules, SiC/GaN power devices, power converters, and inverters for electric vehicles and industrial drives.
Optoelectronics – High-power laser diodes, LED packaging, optical transceivers, and photodetectors.
RF & Microwave – GaN amplifiers, radar modules, and high-frequency power transistors.
Aerospace & Defense – Thermal management for avionics, satellite electronics, and high-reliability systems.
Semiconductor Packaging – Heat spreaders, lids, and substrates for high-performance processors and ASICs.
Research & Development – Advanced thermal management prototyping and material characterization.

IDM Customization Service

From advanced processes to specialty processes, we use our IDM vertical integration experience to help customers overcome design-process collaboration challenges.

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Supports advanced nodes such as [5-22nm FinFET/BCD/GAA] to meet the needs of high-performance computing (HPC), AI chips, etc.

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MPW (Multi-Project Wafer) Service: Small batch trial production to reduce customers' initial costs. Customized process development: Cooperate with customers to conduct DTCO (Design-Process Co-Optimization), customize design rules and process parameters.

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We support the joint solution of "wafer foundry + advanced packaging" (such as 3D IC, heterogeneous integration) to avoid the loss of multi-supplier collaboration. Unlike pure foundries, we verify the process stability through mass production of our own chips to reduce the risk of tape-out for you.

Provide customers with complete integrated manufacturing services from concept to finished product

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Electronic manufacturing services and printed circuit board assembly.

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EMS provides a wide range of electronic manufacturing services, including everything from circuit board design to supply chain management to assembly, testing and after-sales support.

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PCBA is a link in EMS that focuses on the assembly of printed circuit boards, covering component placement, soldering and related testing, connecting electronic components to manufactured printed circuit boards.