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ABF substrate (epoxy resin deposited film)
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Aluminum Substrate
BT resin (bismaleimide triazine resin)
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Ceramic ball array housing (CBGA)
Ceramic double row direct insertion package (CDIP)
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Ceramic small form factor packaged (CSOP)
Copper Substrate
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FR-4 (glass fiber reinforced epoxy resin)
Gallium Arsenide (GaAs)
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Monocrystalline silicon
Multilayer Ceramic Carrier
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Pottery and porcelain DIP
Pottery and porcelain QFP
Pottery and porcelain SOP
Silicon And Germanium (SiGe)
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Zinc Oxide (ZnO)
Zirconia
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1310 nm DFB Epitaxial Wafer: What Laser Chip Teams Need Before Fabrication
2026-11-12
A DFB epitaxial wafer arrives many steps before a working laser. “1310 nm” cannot settle...
