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Thermal Management Composites
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Diamond Heat Spreader
Ceramic Dual In-line Package (CDIP)
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Maskless Lithography/LDI-laser direct imager
Mask Aligner
Wet etching equipment
ICP RIE System (III-V and Metal Etching)
Deep RIE System (SiOx, SiNx and Deep Si Etching)
PECVD (Plasma Enhanced Vapour Deposition System andGas System for Etching&PECVD Systems
Optical Microscopes
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E-beam Evaporation System
ALD System (Atomic Layer Deposition)
Automatic Dicing Saw Machine
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AOI test equipment
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X-RAY point equipment
Electroplating equipment
Glovebox System
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Wafer polishing equipment
Wafer thinning device
Raman Microscope and Spectrometer RAMAN
Wire&Die Bonder Machine
Scanning Electron Microscope&EDS-Energy Dispersive Spectrometer
Sensor Chip Series
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X-Band GaN PA MMIC
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ABF substrate (epoxy resin deposited film)
Alumina Ceramic Substrate
Aluminium Arsenide (AiAs)
Aluminium Nitride (AIN)
Aluminum Substrate
BT resin (bismaleimide triazine resin)
Butterfly package
Cadmium Telluride (CdTe)
Ceramic ball array housing (CBGA)
Ceramic double row direct insertion package (CDIP)
Ceramic four-sided lead flat package (CQFP)
Ceramic leadless chip carrier housing (CLCC)
Ceramic needle grid matrix encapsulated (CPGA)
Ceramic small form factor packaged (CSOP)
Copper Substrate
Diamond
Epitaxial silicon
FR-4 (glass fiber reinforced epoxy resin)
Gallium Arsenide (GaAs)
Gallium Nitride (GaN)
Germanium
Glass Substrate
Glass wafer
Graphene
Indium Arsenide (InAs)
Indium phosphide (InP)
Indium Tin Oxide (ITO)
Monocrystalline silicon
Multilayer Ceramic Carrier
Polycrystalline silicon
Pottery and porcelain DIP
Pottery and porcelain QFP
Pottery and porcelain SOP
Silicon And Germanium (SiGe)
Silicon Carbide (SiC)
Silicon Nitride
Silicon On Insulators (Soi)
Zinc Oxide (ZnO)
Zirconia
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